Adhesive composition for halogen-free covering film and covering film coated by the same

A cover film and adhesive technology, applied in the direction of film/sheet adhesive, non-polymer adhesive additive, adhesive type, etc., can solve the degradation of heat resistance and adhesive strength of cover film, The cover film does not meet the required performance, etc.

Inactive Publication Date: 2012-10-10
TORAY ADVANCED MATERIALS KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, efforts have been made to develop cover films using various organic-based flame retardants instead of halogen-based flame retardants; however, such cover films do not satisfy all the required properties
In particular, the biggest problem is that the heat resistance and adhesive strength of the cover film deteriorate due to the environment or the humidity condition to which the cover film is repeatedly exposed during processing

Method used

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  • Adhesive composition for halogen-free covering film and covering film coated by the same
  • Adhesive composition for halogen-free covering film and covering film coated by the same
  • Adhesive composition for halogen-free covering film and covering film coated by the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The components shown in Table 1 below and methyl ethyl ketone with a solid content of 30% were added and uniformly mixed with a homogenizer. Next, the mixed composition was applied on a polyimide film having a thickness of 12.5 μm in such a manner that the thickness after drying was 25 μm, followed by drying and thermal curing in an oven at 50° C. for 10 minutes, and at 160° C. °C Dry in an oven and heat cure for 3 minutes. Finally, a release paper was laminated thereon to prepare a cover film.

Embodiment 2~4

[0053] Cover films were prepared in the same manner as in Example 1 except that the components of the adhesive were added as shown in Examples 2 to 4 of Table 1 below.

[0054] [Table 1]

[0055]

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Abstract

The present invention generally relates to an adhesive composition for halogen-free coverlay film and a coverlay film coated by the same. More particularly, the invention relates to the adhesive composition for the halogen-free coverlay film and the coverlay film coated by the same. The adhesive composition has undeteriorated binding strength and heat resistance in a humidity condition in which the covering film is covered through replacing NBR (nitrile butadiene rubber) which is commonly used as the adhesive for cover binding by the acrylic acid copolymer that contains hydroxy and carboxyl. Thus the adhesive composition for the halogen-free coverlay film comprises the following components: (1) acrylic resin which contains hydroxy and carboxyl and has a weight average molar mass of 300,000-800,000 and a viscosity of 800-10,000cP in 25 DEG C; (2) phenolic resin; (3) multifunctional epoxide resin; (4) solidifying agent; (5) solidifying promoting agent; (6) flame retardant based on non-halogen; (7) inorganic particles and (8) cross linker.

Description

technical field [0001] The present invention generally relates to an adhesive composition for a halogen-free cover film and a cover film coated with the adhesive composition, and more particularly, the present invention relates to an adhesive composition for a halogen-free cover film and A cover film coated with the adhesive composition by using an acrylic copolymer containing a hydroxyl group and a carboxyl group in place of NBR (Nitrile Butadiene Rubber) which is generally used as an adhesive for cover bonding so that the Adhesive strength and heat resistance are not deteriorated under the humidity conditions to which the cover film is exposed. Background technique [0002] Recently, the use of flexible printed circuit boards (PCBs) has greatly increased due to the trend of requiring electronic products to have smaller sizes, ultra-thin thicknesses, and higher integration. This has led to an increase in the use of cover films for protecting circuits. In addition, due to t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/00C09J161/06C09J163/00C09J163/02C09J163/04C09J11/02B32B7/12B32B27/10
CPCC09J7/385C09J133/06C09J163/00C09J2203/326
Inventor 金佑锡文基祯全海尚
Owner TORAY ADVANCED MATERIALS KOREA
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