Adhesive resin composition, laminate using same, and flexible printed wiring board

一种树脂组合物、胶粘性的技术，应用在印刷电路、印刷电路制造、印刷电路零部件等方向，能够解决不能获得胶粘强度等问题，达到良好储存稳定性、相容性良好、满足阻燃性的效果

Active Publication Date: 2014-07-30
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, curing may progress gradually during storage and the desired adhesive strength may not be achieved

Method used

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  • Adhesive resin composition, laminate using same, and flexible printed wiring board
  • Adhesive resin composition, laminate using same, and flexible printed wiring board
  • Adhesive resin composition, laminate using same, and flexible printed wiring board

Examples

Experimental program
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Effect test

preparation example Construction

[0076] [Preparation of Adhesive Resin Composition and Adhesive Solution]

[0077] The adhesive resin composition of the present invention is prepared by mixing the above-mentioned components (A) to (D), and the required non-halogen flame retardant and other additives.

[0078] The adhesive resin composition is preferably prepared such that the percentage of phosphorus in the resin composition is 3.1% by mass to 4.5% by mass.

[0079] In addition, curing accelerators, silane coupling agents, leveling agents, defoamers, and other additives may be mixed as needed. However, when using phosphorus-containing epoxy resins and introducing benzo In the case of oxazine compounds, the addition of curing accelerators tends to shorten the pot life of the adhesive and reduce adhesive properties. Therefore, it is not desirable to mix a curing accelerator. In addition, the addition of inorganic fillers tends to reduce adhesive properties and migration characteristics, and therefore, mixin...

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PUM

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Abstract

The present invention provides an adhesive resin composition, which comprises: epoxy resin and / or phenoxy resin; epoxy-group-containing copolymer, which can be combined with the epoxy-group-containing monomer and the A monomer obtained by copolymerizing an ethylenically unsaturated monomer having an epoxy group; a thermoplastic resin; and a curing agent. The epoxy group-containing copolymer has a weight average molecular weight of 5,000 or more and less than 100,000 and an epoxy equivalent of not more than 3,500 g / eq. The adhesive resin composition can provide a one-component adhesive solution that is halogen-free and has excellent flame retardancy, excellent polymer component compatibility, and excellent storage stability. The present invention also provides a laminate using the adhesive resin composition, and a flexible printed wiring board.

Description

technical field [0001] The present invention relates to an adhesive resin composition suitable for use in flexible printed wiring boards such as flexible copper-clad laminates, in particular, to an adhesive resin composition usable as a one-component type resin composition, and using the Flexible printed wiring boards and laminates such as adhesive sheets and cover films of adhesive resin compositions. Background technique [0002] In general, a flexible printed wiring board has a base structure in which a copper foil or the like is bonded with an adhesive to one or both sides of an insulating film composed of a heat-resistant film such as a polyimide film serving as a base material. [0003] As such adhesives used in flexible printed wiring boards, hitherto, adhesive compositions containing thermosetting resins contributing to chemical resistance, heat resistance and mechanical strength have been mainly used Such as epoxy resin, and reactive rubber such as acrylonitrile-bu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00B32B27/38C09J7/02C09J11/06C09J171/10C09J201/06H05K1/03C09J7/35
CPCY10T428/287C08G2650/56H05K1/0393C09J2203/326H05K3/386C09J171/02C08L33/068C09J2463/00C08L63/00C08L71/00C09J163/00C09J2477/00C09J171/00C09J7/0203C09J2471/00C09J7/35C08L2666/02C08L2666/04C09J7/22C09J7/30B32B27/38H05K1/0313C09J2203/00
Inventor 改森信吾菅原润沟口晃浅井省吾吉坂琢磨上西直太
Owner SUMITOMO ELECTRIC IND LTD
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