Halogen-free cover film adhesion agent

Abstract

The invention discloses a halogen-free cover film adhesion agent. The halogen-free cover film adhesion agent comprises nine components, wherein the first component is a rubber solution prepared from rubber and butanone, the second component comprises the rubber solution, aluminum hydroxide powder and butanone, the third component comprises the rubber solution, a fire retardant and butanone; the fourth component comprises resin and butanone; the fifth component comprises epoxy resin and butanone; the sixth component comprises dicyandiamide and ethylene glycol monomethyl ether; the seventh component comprises diaminodiphenylsulfone and ethylene glycol monomethyl ether; the eighth component comprises a rubber solution, an ion exchanger and butanone; the ninth component is resin. The halogen-free cover film adhesion agent is reasonable in design, and meets the performance such as fire resistance, bonding strength and heat resistance which are needed in a cover film, the performance of the adhesion agent is not degraded even if the adhesion agent is exposed to the high-humidity condition, the environment is effectively protected, and the cover film can meet the national and international standards.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to a halogen-free covering film adhesive. Background technique [0002] Recently, the use of flexible printed circuit boards (PCBs) has greatly increased due to the trend of requiring electronic products to have smaller sizes, ultra-thin thicknesses, and higher integration. This has led to an increase in the use of cover films for protecting circuits. In addition, due to the improvement of product functions, the structure of electronic products has become more complex, and the requirements for the performance of the cover film have become more stringent. [0003] Currently, in accordance with WEEE (Waste Electrical and Electronic Equipment), RoHS (Restriction of Hazardous Substances) and the like in Europe, there is a strong need to develop environmentally friendly materials. However, conventional adhesives used for electronic materials such as cover films, semiconductor sealin...

AI Technical Summary

Problems solved by technology

[0004] Therefore, efforts have been made to develop cover films using various organic-based flame retardants instead of halogen-based flame retardants, however, such cover films do not satisfy all required properties

In particular, the biggest problem is that the heat resistance and adhesive strength of the cover film deteriorate due to the environment or the humidity condition to which the cover film is repeatedly exposed during processing