Polyester-imide precursor and polyester-imide

A technology of polyesterimide and polyesterimide layer, which is applied in the field of polyesterimide precursor and polyesterimide, can solve the problems of the reduction of mechanical properties of polyimide film, and achieve high tearing cracking strength, low hygroscopic expansion coefficient, and high adhesiveness

Inactive Publication Date: 2011-04-20
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the obtained crude crystals are used for copolymerization with aromatic diamines, a part of the obtained polyimide precursor solution is gelled. In addition, when the polyimide precursor solution is used to prepare a polyimide film, it may occur Disadvantages of Remarkably Decreased Mechanical Properties of Polyimide Films

Method used

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  • Polyester-imide precursor and polyester-imide
  • Polyester-imide precursor and polyester-imide
  • Polyester-imide precursor and polyester-imide

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0248] (Synthesis Example 1) Synthesis of TABP

[0249] 100 ml of N,N-dimethylformamide solution and 200 mmol of trimellitic anhydride chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) were dissolved in a 1 L separable flask, and cooled to 0° C. in an ice bath under a nitrogen atmosphere. Thereafter, at a stirring speed of 100 rpm, a solution of 4,4'-bisphenol dissolved in 50 ml N, N-dimethylformamide and 50 ml pyridine was added dropwise over 2 hours so that the temperature was below 10° C. Stirring was carried out at room temperature for 6 hours. When the dropwise addition started, the solution turned red, and as the dropwise addition ended, a yellow precipitate formed.

[0250] Next, the precipitate was filtered, washed with N,N-dimethylformamide, further washed with water, and filtered twice, and the filtrate was dried to obtain yellow-white crystals containing TABP. Thereafter, heat drying was performed at 130° C. for 2 hours at a temperature increase rate of...

Embodiment 2

[0267] In a well-dried airtight reaction vessel with a stirrer, add 6.42mmol BPIP, 6.42mmol diamine having an ester structure represented by formula (37) (hereinafter APAB), add 61mL N-methyl-2-pyrrolidone, add the solution to Warm to 80°C to dissolve it. After dissolution, 13.38 mmol of the powder of TABP obtained in Example 1 was slowly added to the solution. By stirring for 30 minutes, the viscosity of the solution increased dramatically. Stirred further 4 hours, obtained transparent, uniform and viscous polyester imide precursor solution, described polyester imide precursor solution has the repeating unit shown in formula (11) and formula (12) The repeating unit, the molar ratio of formula (11) and formula (12) is the ratio of formula (11) / formula (12)=50 / 50. Here, in formula (12), B 2 is a divalent aromatic group represented by formula (16).

[0268] According to the method described in Example 1, a film was formed and imidized to produce a polyester imide film, and t...

Embodiment 3

[0276] In a well-dried airtight reaction vessel with a stirrer, add 8.99mmol BPIP, 3.85mmol APAB, add 63mL N-methyl-2-pyrrolidone, and heat the solution to 80°C to dissolve it. After dissolution, 13.38 mmol of TABP obtained in Example 1 was slowly added to the solution. By stirring for 30 minutes, the viscosity of the solution increased dramatically. Further stirring for 4 hours, a transparent, uniform and viscous polyester imide precursor solution was obtained. The polyester imide precursor solution has a repeating unit shown in general formula (11) and general formula (12) For the repeating unit shown, the molar ratio of general formula (11) to general formula (12) is the ratio of general formula (11) / general formula (12)=70 / 30. Here, in general formula (12), B 2 is a divalent aromatic group represented by formula (16).

[0277] According to the method described in Example 1, a film was formed and imidized to produce a polyester imide film, and the physical properties wer...

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Abstract

A polyester-imide precursor characterized by having repeating units represented by the following formula (1). (In the formula (1), Ar is the tetravalent aromatic group represented by the formula (2) and B1 is an ester structure having a specific structure.).

Description

technical field [0001] The present invention relates to a polyesterimide precursor and polyesterimide used in laminates such as flexible printed circuit boards. Background technique [0002] Polyimide not only has excellent heat resistance, but also has characteristics such as chemical resistance, radiation resistance, electrical insulation, and excellent mechanical properties. Therefore, it is widely used in FPC (Flexible Printed Circuit, Flexible Printed Circuit) ) substrates, base materials for TAB (Tape Automated Bonding), protective films for semiconductor elements, interlayer insulating films for integrated circuits, and other electronic devices. Furthermore, in addition to these characteristics, polyimide has a simple production method and extremely high film purity, and therefore, its importance has become increasingly prominent in recent years. [0003] With the progress of thinner, thinner and smaller electronic devices, the strictness of the characteristics requi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/16B32B15/088H05K1/03
CPCC08G73/16B32B15/08H05K1/0346H05K2201/0145H05K1/0326B32B27/36H05K2201/0154C08L79/08B32B27/281B32B2307/3065B32B2307/50B32B2307/5825B32B2457/08
Inventor 加藤明宏小泉彻
Owner ASAHI KASEI E-MATERIALS CORPORATION
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