Wire type surface tinning device and improved tinning technological method thereof

A technology of tin plating device and surface treatment device, applied in hot dip plating process, metal material coating process, coating and other directions, can solve the problems of poor tin unevenness, product appearance influence, poor tin permeability, etc., and achieve good tin The effect of the degree of impregnation

CN102031473BInactive Publication Date: 2012-09-05NISSEI ELECTRIC (KUNSHAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2012-09-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a wire type surface tinning device and an improved tinning technological method thereof. The wire type surface tinning device mainly comprises an article to be tinned, a cleaning treatment circulating groove, a tinning groove and a surface treatment device. The surface treatment device is arranged between the article to be tinned and the cleaning treatment circulating groove and comprises a treatment groove. The treatment groove is internally provided with two multi-grooved pulley groups. Each multi-grooved pulley group is provided with at least one grooved pulley. The multi-grooved pulley groups can freely rotate in the treatment groove in which treating fluid is held. The multi-grooved pulley groups can be rightly and completely immersed in the treating fluid. A cross bar is provided. The two ends of the cross bar are pivoted to the axes of the two multi-grooved pulley groups. The radial surfaces of the corresponding grooved pulleys of the two multi-grooved pulley groups are in the same plane. The wire type surface tinning device corresponds to the tinning technological method applying the same so that the surface of a product electroplated finally is extremely good in tin dipping degree and is very smooth.
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Description

technical field

[0001] The invention relates to a tinning process, in particular to a tinning device for the surface of wires and an improved tinning process method thereof. Background technique

[0002] When producing tin-plated products, it is necessary to dip the marshalled product (tin-plated annealed copper wire) into a tin bath for tin plating, such as figure 1 The tin in the tin bath shown is not easy to hang on the surface of the product to be plated. Poor tin permeability, small holes, and tin bumps often appear on the surface, which have a great impact on the appearance of the product and directly affect the production efficiency. Contents of the invention

[0003] In order to overcome the above defects, the present invention provides a tinning device for the surface of wires and its improved tinning process, which can effectively improve the roughness of the surface of the product to be plated, so that it is just suitable for hanging tin in the tin bath, Improv...

Examples

Embodiment

[0016] Embodiment: a kind of wire surface tin plating device, it mainly comprises to-be-plated product 6, cleaning treatment circulation tank 7 and tin-plating tank 8, is also provided with a surface treatment device 1, and described surface treatment device 1 is arranged on the to-be-plated product 6 and the cleaning treatment circulation tank 7, the surface treatment device includes a treatment tank 11, in which at least one set of multi-groove wheel sets 2 is arranged, and each set of multi-groove wheel sets 2 is provided with at least one groove Wheel, the multi-groove wheel set 2 can rotate freely in the treatment tank 11, the treatment liquid 3 is housed in the treatment tank 11, and the multi-groove wheel set can be completely immersed in the treatment liquid;

[0017] The treatment tank 11 of the surface treatment device 1 is provided with two groups of multi-groove wheel sets 2, and a cross bar 4 is provided. The radial planes of the corresponding groove wheels in the...