Full keyboard components, manufacturing method and full keyboard thereof

A production method and technology of a full keyboard, applied to electrical components, electric switches, circuits, etc., can solve the problems of insufficient rigidity of the full keyboard assembly, unstable production, thick full keyboard, etc., and achieve good rigidity, high production efficiency, and benefit reduction. thin effect

Inactive Publication Date: 2011-04-27
SUZHOU SHIHAO BUILDING MATERIAL NEW TECH ENG
View PDF4 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The present invention aims to solve the shortcomings of insufficient rigidity of the full keyboard assembly obtained by the existing method for making keys, which is easy to cause interlocking, thick full keyboard or unstable production, and provides a thin full keyboard assembly with good rigidity, which is not easy to happen interlocking, and thin Moreover, the full keyboard assembly capable of stable production and the manufacturing method thereof and the full keyboard thereof

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full keyboard components, manufacturing method and full keyboard thereof
  • Full keyboard components, manufacturing method and full keyboard thereof
  • Full keyboard components, manufacturing method and full keyboard thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment is used to illustrate the full keyboard assembly provided by the present invention and its manufacturing method.

[0041] Use the method of screen printing to print anti-stretch white ink (Seiko, IUX series) on one surface of a TPU film with a size of 275 × 170 × 0.15mm, forming such as figure 1 The pattern shown in 5, and then use the screen printing method to print black ink (Japanese Imperial ink, INQ-971) on the same surface of the TPU film, and then perform far-infrared baking on the formed ink layer , the baking temperature is 100° C., and the baking time is 10 minutes.

[0042] Coat liquid silicone (Zhongshan Polymer Electronic Materials Co., Ltd., 9150A and 9150B) on the surface of the above TPU sheet (that is, the side where the ink is printed), put the silicone-coated side up, and put the TPU together with the silicone into the concave mold , close the mold after setting the position, and apply 120kg / cm to the mold through the molding machine ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides full keyboard components which comprise a silica gel key body, wherein the key body comprises a plurality of first bulges on the upper surface, the first bulges are the key parts of the full keyboard components, and the key body also comprises a plurality of second bulges on the lower surface; film layers covered on the surface of the key body and coated the first bulges; and a bracket body sleeved at the bottoms of the first bulges. The thickness of the full keyboard components provided by the invention are thinner, a full keyboard has good rigidity, furthermore packaging technology is simple, the manufacturing method of the full keyboard components provided by the invention has simple technology and high production efficiency, and can enable the production quantity to be stable. In addition, because the second bulges at the corresponding position of each key are contact with a metal sheet, thereby ensuring the accuracy of each contact; and the thin film layer connected between keys is very thin, has much strong deformability, in addition, because of the support and fixation effects of the bracket body, the first bulges are discontinuous, thereby solving the linkage problem.

Description

technical field [0001] The invention relates to a full keyboard assembly and its manufacturing method and the full keyboard. Background technique [0002] With the rapid development of science and technology today, people have higher and higher requirements for mobile phones. Not only must mobile phones have complete functions and excellent quality, but also put forward higher requirements for the appearance and thickness of mobile phones. [0003] At present, many mobile phones will be equipped with a full QWERTY keyboard, that is, a full keyboard layout in which the first six letters of the first line are Q, W, E, R, T, and Y, which is the computer full keyboard layout commonly used now. Corresponds to a character printed with a number or letter. [0004] There are two main manufacturing methods of the existing buttons: the plastic flat full keyboard method and the ultra-thin P+R method (P refers to Plastic-plastic, R refers to Rubber-rubber), and then the buttons are ass...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01H13/705H01H13/70H01H13/88
Inventor 王小军俞军
Owner SUZHOU SHIHAO BUILDING MATERIAL NEW TECH ENG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap