Light-emitting diode (LED)
A technology of light-emitting diodes and reflector cups, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as difficulty in injection, damage to circuit boards, and inability to be densely arranged, and achieve the effect of increasing heat dissipation efficiency
Inactive Publication Date: 2011-05-04
EVERLIGHT ELECTRONICS
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Problems solved by technology
However, the standard flat-top LEDs 30 must use a glue dispensing process, so they cannot be densely arranged. In addition, due to the relationship between folding feet and difficulty in injection, the standard flat-top LEDs 30 cannot be miniaturized and thinned.
[0005] Please refer to the structure of the surface-mounted light-emitting diode of China Taiwan Patent No. 560697. This known light-emitting diode directly accommodates the reflective cup in the circuit board, and the light-emitting diode chip is arranged on the reflective cup. Therefore, the heat of the light-emitting diode will be reduced. It is directly transmitted to the reflective cup, and then conducts heat to the circuit board through the reflective cup, so that the heat dissipation area cannot be independent, and excessive heat energy may also cause damage to the circuit board
Method used
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[0059] Figure 4 It is an exploded schematic view of the light-emitting diode of the present invention, Figure 5 It is a schematic diagram of the packaging of the light-emitting diode of the present invention, Figure 6 It is a schematic diagram of another viewing angle of the light emitting diode of the present invention.
[0060] see Figure 4-Figure 6 , the light emitting diode 40 includes a light emitting diode chip 41 , a lens 42 , a reflective cup 43 , a circuit connecting board 44 , a circuit substrate 45 and wires 46 . The light emitting diode chip 41 includes two wires 411, 412, the wires 411, 412 are electrically connected to the light emitting diode chip 41, and the lens 42 is covered on the light emitting diode chip 41 and the reflective cup 43 to change the intensity of the light emitted by the light emitting diode chip 41. The reflection cup 43 is used to accommodate the LED chip 41 and reflect the light emitted by the LED chip 41. The circuit connection boar...
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The invention discloses a light-emitting diode (LED), comprising an LED chip, a reflector cup, a lens, a circuit connecting board, a circuit substrate and leads, wherein the LED chip is arranged in the reflector cup, and the lens covers the reflector cup and the LED chip; the LED chip is electrically connected with the circuit connecting board which is provided with a first hole, and the circuit substrate is provided with a second hole; the leads are arranged in the first hole and the second hole and enable the circuit connecting board to be electrically connected with the circuit substrate; the reflector cup is arranged between the circuit connecting board and the circuit substrate; and the positions of the first hole and the second hole are not close to the reflector cup. In the invention, the reflector cup is not in direct contact with the circuit design position on the surface of the circuit connecting board, thus heat generated by the LED chip has no influence on the operation of the circuit connecting board, and the radiating area of the reflector cup can be kept independent. In addition, the groove body of the reflector cup is directly exposed via a containing hole, thus enhancing the radiating efficiency.
Description
technical field [0001] The invention relates to a light emitting diode, in particular to a packaging structure of a light emitting diode. Background technique [0002] The packaging methods of light emitting diodes include lamp type, PCB type and standard flat top type (PLCC type). figure 1 For a schematic diagram of a known bracket-type light-emitting diode, please refer to figure 1 , the bracket type LED 10 includes a lens 11, brackets 12a, 12b, LED chips 13 and wires 14, a reflector 121 is formed in a stamping manner on the bracket 12a, and the LED chip 13 is arranged in the reflector 121, so that the LED The light generated by the chip 13 can be fully reflected upwards. The LED chip 13 is directly electrically connected to the bracket 12a, and is electrically connected to the bracket 12b through a wire 14, and the lens 11 covers the entire LED chip 13. Since the bracket-type LED 10 can be stamped to form the reflective portion 121 , the reflective portion 121 is relati...
Claims
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Inventor 谢忠全
Owner EVERLIGHT ELECTRONICS