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Method for processing fragile material substrate

A technology of brittle material substrates and processing methods, which is applied in stone processing equipment, stone processing tools, metal processing equipment, etc., and can solve the problems of substrate glass shavings and other issues

Inactive Publication Date: 2011-05-04
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During mechanical breaking, glass shavings may be generated when a large bending moment is applied to the substrate

Method used

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  • Method for processing fragile material substrate
  • Method for processing fragile material substrate
  • Method for processing fragile material substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0074] (device configuration)

[0075] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0076] First, an example of a substrate processing apparatus used for carrying out the processing method of the present invention will be described. figure 1 It is a schematic configuration diagram of a laser cutting device LC1 according to an embodiment of the present invention. figure 2 for display figure 1 The block diagram of the control system of the laser cutting device LC1.

[0077] first based on figure 1 The overall configuration of the laser cutting device LC1 will be described.

[0078] A pair of guide rails 3 and 4 arranged in parallel on the horizontal platform 1 are arranged on the figure 1 The sliding platform 2 that moves back and forth in the front and rear direction (hereinafter referred to as the Y direction) of the paper. A lead screw 5 is disposed between the two guide rails 3 and 4 along the front and rear directio...

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PUM

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Abstract

Provided is a method for processing a fragile material substrate that enables to stably execute processes, such as complete cutting off of the substrate and forming of a deeper scribe line. A method for processing a fragile material substrate comprises a laser scribe step of relatively moving a beam spot by the first laser irradiation to heat the substrate, and cooling an immediate portion where the first beam spot has passed to form a scribe line; and a laser break step of relatively moving a second beam spot by the second laser irradiation along the scribe line and making the scribe line to penetrate further deeply or completely cutting off the scribe line. In the laser break process, a laser beam diameter incident on a polygonal mirror in the laser break step is adjusted to be smaller than an incident laser beam diameter in the laser scribe step, so that an energy distribution of the second beam spot is made to be top-hat type further than that of the first beam spot and is irradiated.

Description

technical field [0001] The present invention relates to repeatedly reflecting the laser beam by a polygonal mirror rotating at high speed to shape the beam spot substantially having a major axis direction on the brittle material substrate, and scan the aforementioned beam spot along the scribing predetermined line set on the aforementioned brittle material substrate, A processing method for substrates of brittle materials utilizing thermal stress to form cracks. [0002] Specifically, the present invention relates to scanning a brittle material substrate for the first time with a beam spot to form a scribed line composed of cracks of limited depth, and then performing a second beam spot scan to penetrate deeply into the scribed line. (Hereinafter, cracks in the depth direction are referred to as penetration) or a method of processing a brittle material substrate that is completely broken. [0003] Here, the brittle material substrate refers to glass substrates, ceramics made ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B23K26/00B23K26/38C03B33/09B23K26/364
CPCB23K26/0821B23K26/40B23K2103/50B28D1/221C03B33/037C03B33/07C03B33/093
Inventor 熊谷透平內裕介井上修一山本幸司
Owner MITSUBOSHI DIAMOND IND CO LTD
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