Method for manufacturing electric conduction plug

Abstract

The invention provides a method for manufacturing an electric conduction plug. In the method, pre-wet solution is coated on an anti-reflection layer, and then optical resist is formed on the anti-reflection layer, so that the formed electric conduction plug has a large depth-to-width ratio, and the electric conduction plug and a conducting layer are hardly short-circuited.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a method for manufacturing a conductive plug in a semiconductor chip. Background technique [0002] In a semiconductor chip, it is often necessary to electrically connect a certain layer of metal to another layer of metal through conductive plugs. However, in the process of manufacturing conductive plugs, the conductive plugs often short-circuit with other conductive layers, especially for small-sized and highly integrated chips, it is even more difficult to manufacture conductive plugs with high aspect ratios. [0003] Combine the following Figure 1a-Figure 1d , to describe the manufacturing method of the conductive plug in the prior art. [0004] First, a substrate for manufacturing conductive plugs is provided. Referring to FIG. 1, the substrate includes: a first conductive layer 100, a passivation layer 101 on the first conductive layer 100, and a g...

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Problems solved by technology

[0009] In order to solve the problem that a relatively large part of the conductive plug is short-circuited with the gate conductive layer in the prior art, the present invention provides a method for manufacturing the conductive plug

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