Semiconductor wafer and pattern alignment method
A semiconductor and wafer technology, applied in the field of pattern alignment methods and design structures for manufacturing these semiconductor components, can solve problems such as unsatisfactory alignment of alignment technology, and achieve the effect of improving alignment
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[0038] It can be understood that the following disclosure provides many different embodiments or examples to implement different features of the present invention. The specific examples of components and arrangements described below are to simplify the invention. Of course, these are only examples, not limitations. In addition, the present invention may repeat reference numbers and / or words in each example. Such repetition is for the purpose of simplicity and clarity, and is not used in itself to specify the relationship between the discussed embodiments and / or configurations. Furthermore, in the description, the first feature formed on or on the second feature may include embodiments in which the first and second features are formed in direct contact, and may also include additional features that may be formed on the first and second features. The embodiment between the two features, so the first and second features may not directly contact.
[0039] figure 1 The wafer 100 is...
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