Method for detecting interlayer offset and drilling offset of multi-layer circuit board

Abstract

The present invention relates to a method for detecting an interlayer offset and a drilling offset of a multi-layer circuit board, which comprises arranging detection modules in the middle of each long edge and at board corners of each short edge outside a formation area of each layer of circuit board. The detection modules comprise an isolating frame, a plurality of hole offset measuring rings and a plurality of layer offset monitoring rings, wherein the isolating frame comprises two parallel copper bars and copper semicircular rings connected with the two ends of the two parallel copper bars, the hole offset measuring rings and the layer offset monitoring rings are arranged on the copper bars of the isolating frame with the same spacing, the centers of the hole offset measuring rings and the layer offset monitoring rings are arranged linearly, the hole offset measuring rings comprise 6-8 copper-free rings, the parts of each layer of circuit board for the copper-free rings are removed, the spacing of the copper-free rings on each layer of circuit board is 1.98MM, and the midpoint of the straight line for arrangement of the centers of the copper-free rings is 0.9MM away from the outer edges of the copper bars of the isolating frame and 6MM away from the ends of the copper semicircular rings. Since the detection modules are arranged in the middle of each long edge and at the board corners of each short edge outside the formation area of each layer of circuit board, the offset of all internal layers of the multi-layer circuit board can be detected comprehensively, the interlayer offset and the drilling offset can be detected simultaneously, and the offset can be read directly.

Description

technical field [0001] The invention relates to the technical field of multilayer circuit board production, in particular to a detection method for interlayer and drilling offset of a multilayer circuit board. Background technique [0002] Circuit boards are divided into single-sided, double-sided and multi-layer circuit boards according to the number of layers. Due to the increase in the packaging density of integrated circuits, the interconnection lines are highly concentrated, which makes multi-layer circuit boards gradually widely used. Each layer of a multilayer circuit board is composed of upper and lower inner layers of copper foil and an insulating layer between them, and each layer is bonded to each other by an adhesive, and the copper foils of each layer are not connected. state. Therefore, in order to realize the interconnection between the circuits of each layer, it is necessary to form a through hole by drilling, and then electroplate the through hole to form a...

AI Technical Summary

Problems solved by technology

This method solves the technical problems of the longitudinal slicing method, but it also has many defects. It can only judge the offset of the CORE by setting the etched ring on the odd or even layer, but it cannot judge the offset of the drill hole. , it is not possible to directly judge the offset of a specific layer, and it is not possible to directly read the interlayer offset by measuring the resistance meter

Images