Liquid processing apparatus, liquid processing method and storage medium

Abstract

The invention provides a liquid processing apparatus, a liquid processing method and a storage medium.According to the liquid processing apparatus and the liquid processing method, the gas-discharging amount in a cup is inhibited when a rotating substrate is subjected to the solution treatment at the same time.Meanwhile, mist is prevented from rebounding from the cup and the attachment of the mist to the substrate is also avoided.During the discharge period of the resist of a wafer (W), the cleaning fluid is discharged out of a flow path forming member (50) along the inner surface of the outside of the cup body (42).A liquid film of the cleaning fluid is formed on the inner wall of the outside of the cup body (42).The resist swung out by the wafer (W) is caught by the liquid film of the cleaning fluid.After catching the resist, the cleaning fluid is recycled to a chute part (53) arranged at the bottom of the outside of the cup body (42) and is discharged again out of the flow path forming member (50) along the inner surface of the outside of the cup body (42).

Description

technical field [0001] The present invention relates to the technical field of supplying a processing liquid from a nozzle to a substrate such as a semiconductor wafer and performing liquid processing while rotating the substrate. Background technique [0002] In the semiconductor manufacturing process, there is a process of supplying a processing liquid to a substrate and performing liquid processing while rotating the substrate. Specifically, for example, the following steps can be mentioned: a step of supplying a resist solution to the substrate by spin coating; and a step of supplying a solvent for removing the resist on the peripheral edge of the substrate after forming a resist film on the substrate surface. ; the process of cleaning the substrate with a cleaning solution after the development treatment of the substrate; and the process of cleaning the surface of the substrate in order to remove particles, for example. In addition, the cleaning liquid becomes the proc...

AI Technical Summary

Problems solved by technology

However, these devices do not mention the subject of reducing the exhaust volume of the cup body.

In addition, since the substrate is cleaned after the liquid treatment, the next wafer cannot be subjected to the liquid treatment during the cleaning, so it does not contribute much to the improvement of the wafer manufacturing efficiency.

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