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Method for preparing flexible copper clad laminate

A technology of flexible copper-clad laminates and copper foils, which is applied in the direction of coating liquid devices and coatings on the surface, and can solve problems such as warping of flexible copper-clad laminates

Inactive Publication Date: 2011-06-01
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a method for preparing a flexible copper-clad laminate to solve the technical problem of warping of the existing flexible copper-clad laminate in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0013] The invention provides a method for preparing a flexible copper-clad laminate. The preparation method includes a method for forming a polyimide film on a copper foil, and the method for forming a polyimide film on a copper foil includes: Process it into a copper foil with at least one rough surface, then coat the polyamic acid precursor slurry on the rough surface of the copper foil for the first time, and heat it for the first time to obtain a polyamic acid / copper foil composite board, coating the polyamic acid precursor solution on the polyamic acid surface in the polyamic acid / copper foil composite board for the second time, and heating for the second time.

[0014] In this method, in order to ensure the bonding force between the copper foil and the polyimide layer in the final product, the surface of the copper foil is processed into a copper foil with a surface roughness of 4-7 μm, and the thickness of the copper foil is 9- 35 μm, then the polyamic acid precursor s...

Embodiment 1

[0028] Mix diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, and N,N-dimethylacetamide in a ratio of 93.4:198:1457, and control the temperature at 20°C for 9 hours , to obtain a polyamic acid precursor slurry with a solid content of 20% and a viscosity of 35000cp.

[0029] Filter the obtained polyamic acid solution, and vacuum degassing for 2 hours under the condition of a vacuum degree of 0.003 MPa. (Model QTG, Tianjin Jingke Material Testing Machine Factory) is coated on a copper foil with a size of 300mm×270mm×12um and a roughness of 5 microns, put it in an oven, and conduct the first test under a nitrogen atmosphere. Heating, wherein the first coating thickness is 80 μm, the first heating temperature is 70 ° C, and the time is 5 minutes to obtain a polyamic acid / metal foil composite film, and then coat the polyamic acid with a thickness of 100 μm polyamic acid precursor slurry, and the composite plate coated with polyamic acid precursor slurry is heated for the second t...

Embodiment 2

[0031] Mix diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, and N,N-dimethylacetamide in a ratio of 54.5:198:1683, and control the temperature at 20°C for 9 hours , to obtain a polyamic acid precursor slurry with a solid content of 15% and a viscosity of 45000cp.

[0032] Filter the obtained polyamic acid solution, and vacuum degassing for 2 hours under the condition of a vacuum degree of 0.003 MPa. (Model QTG, Tianjin Jingke Material Testing Machine Factory) coated on a copper foil with a size of 300mm×270mm×35μm and a roughness of 7 microns, put it in an oven, and conduct the first test under a nitrogen atmosphere. Heating, wherein the first coating thickness is 50 μm, the first heating temperature is 120 ° C, and the time is 6 minutes to obtain a polyamic acid / metal foil composite film, and then coat the polyamic acid with a thickness of 150 μm The polyamic acid precursor slurry, and the composite board coated with the polyamic acid precursor slurry is heated for the se...

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Abstract

The invention provides a method for preparing a flexible copper clad laminate, and the method comprises the following steps: processing a copper foil into a copper foil provided with at least one rough side; coating a polyamic acid precursor sizing agent on the rough side of the copper foil for the first time; heating the copper foil for the first time so as to acquire a polyamic acid / copper foil compound plate; coating a polyamic acid precursor solution on the polyamic acid surface of the polyamic acid / copper foil compound plate for the second time; and heating the plate for the second time, so as to acquire the flexible copper clad laminate. The flexible copper clad laminate prepared by the method has the advantage of excellent anti-warping property.

Description

technical field [0001] The invention relates to a method for preparing a flexible copper clad laminate Background technique [0002] Flexible copper clad laminate (FCCL) is the base material for the production of flexible printed circuit boards (FPC). In FCCL, it is common to use adhesive to bond polyimide film and copper foil, and there are three layers of glue type. FCCL, such as the use of bismaleimide modified nitrile rubber in the prior art, or epoxy resin, acrylic resin as an adhesive, together with polyimide layer and copper foil to form a flexible cladding with a three-layer structure However, due to the presence of adhesives, the heat resistance and dimensional stability of FCCL are reduced. [0003] With the rapid development of the electronics industry, higher requirements are put forward for the appearance and performance of electronic products. Short, small, light, thin and excellent comprehensive performance have become the first choice of manufacturers and co...

Claims

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Application Information

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IPC IPC(8): B05D1/38
Inventor 吴路生陈靖华杨卫国
Owner BYD CO LTD
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