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Heat dissipation device for electronic circuit module

A heat dissipation device and electronic circuit technology, which is applied in the direction of cooling/ventilation/heating transformation, gasification materials, etc., can solve the urgent problem of heat dissipation of miniaturized electronic equipment, the inability to provide users with a novel experience, and the inability to achieve heat dissipation effects, etc.

Active Publication Date: 2012-11-07
WALTON ADVANCED ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this heat dissipation method cannot achieve a good heat dissipation effect, so the heat dissipation problem of miniaturized electronic equipment is really an urgent issue
In addition, the previous techniques cannot allow the user to obtain additional fun when using the product, and cannot allow the user to have a novel experience when using the product.

Method used

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  • Heat dissipation device for electronic circuit module
  • Heat dissipation device for electronic circuit module
  • Heat dissipation device for electronic circuit module

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Embodiment Construction

[0048] The following embodiments are given in conjunction with the drawings to illustrate the structure and effects of the present invention in detail.

[0049] Such as Figure 2a , Figure 3a and Figure 5a As shown, the first embodiment of the heat dissipation device of the electronic circuit module provided by the present invention mainly includes a substrate 10, a heat dissipation component 20 and a housing 30. The substrate 10 includes at least one electronic component 11. The substrate 10 has an inner surface 101 and an outer surface 102. The substrate 10 may be a high-density multilayer printed circuit board with conduction on both sides, and a circuit (not shown) is formed inside. One end of the outer surface 102 has at least one external contact pad 1021, and the other end has at least one transition contact pad 1022, and the external contact pad 1021 and the transition contact pad 1022 pass through the circuit of the substrate 10 (not shown) and the transition The conta...

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Abstract

The invention relates to a heat dissipation device for an electronic circuit module, comprising a substrate, a heat dissipation assembly and a casing. The casing is of a hollow structure and a runner is formed inside the casing, when a heat source is generated during the running of an electronic component of the substrate, heat is conducted to the heat dissipation assembly by the heat source and then conducted out of the device by generating heat convection in the casing when the heat passes through the runner. By virtue of the heat dissipation device, the electronic circuit module has a better heat dissipation effect.

Description

Technical field [0001] The present invention relates to a heat dissipation device of an electronic circuit module, in particular to a heat dissipation device of an electronic circuit module that conducts heat dissipation through heat conduction and heat convection. Background technique [0002] The current electronic circuit module structure generally uses heat dissipation devices such as fans, heat dissipation fins, heat pipes or water cooling systems for heat dissipation. However, for miniaturized electronic equipment, especially portable data storage devices, these heat dissipation solutions are obviously The volume is too large and the cost is too high. In addition, in recent years, as the memory capacity or additional functions of portable data storage devices have been greatly increased, the subsequent heat dissipation problems caused by the operation of various components have been unavoidable. Such as figure 1 Shown here is a heat dissipation device disclosed in Taiwan P...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20A61L9/03
Inventor 于鸿祺
Owner WALTON ADVANCED ENG INC