Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipation device

A technology of heat dissipation device and heat sink, which is applied in the direction of elastic/clamping device, cooling/ventilation/heating modification, circuit layout on support structure, etc., which can solve the problems of time-consuming, unfavorable resource reuse, and many parts, etc., and achieve assembly and the effect of easy disassembly operation

Inactive Publication Date: 2011-06-08
FU ZHUN PRECISION IND SHENZHEN +1
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned heat dissipation device requires the snap ring to be clamped in the slot of the fastener to pre-assemble the fastener on the base, so that there are many parts during the assembly process of the heat dissipation device, which increases the cumbersomeness of assembly. Moreover, when disassembling the heat dissipation device , it is necessary to use external tools to destroy the circlip, which is not only not conducive to the reuse of resources, but also cumbersome and time-consuming

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation device
  • Heat dissipation device
  • Heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] see Figure 1 to Figure 2 , the heat dissipation device in some embodiments of the present invention is used to dissipate heat from electronic components (not shown) mounted on a circuit board (not shown), which includes a heat conduction base 10, a heat conduction base 10 mounted on the The heat sink 20 and several fasteners 30 installed on the heat conduction base 10 . The heat sink 20 includes a plurality of heat pipes 21 that are thermally connected to the heat conduction base 10 and extend upward from the heat conduction base 10 , a fin group 23 connected in series on these heat pipes 21 , a top surface of the heat conduction base 10 and fins. The cooling block 25 between the fin sets 23 , the fan 27 located on one side of the fin set 23 , and a fan fixing frame 29 fixing the fan 27 to one side of the fin set 23 .

[0018] Please also see Figure 3 to Figure 4 , the heat conduction base 10 includes a substrate 11 and a heat conduction block 13 attached to the bot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a heat dissipation device comprising a heat conductive base and a heat radiator installed on the heat conductive base, the heat conductive base is provided with a plurality of installation feet in an outward extension way, a plurality of fasteners are respectively arranged on each installation foot, each fastener is sleeved with an elastic element and comprises a polish rod and at least one buckling part outwards extending from the side surface at one end part of the polish rod, each installation foot is provided with a through hole for the end part of the polish rod to penetrate through, the bottom surface of the installation hole is provided with at least one clamping groove matched with the buckling part, and at least two baffle blocks are arranged between the clamping groove and the through hole in the circumferential direction and used for preventing at least one of the buckling parts from rotating so that the fasteners are prevented from being separated from the installation feet.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for electronic components. Background technique [0002] With the improvement of computing speed and power consumption of the electronic components inside the electronic device, the corresponding heat generated will also increase sharply. In order to make the electronic components operate at normal operating temperature, it is usually necessary to attach a heat sink on the surface of the electronic components. The device is used to discharge the heat generated by the electronic components in time. [0003] A common heat dissipation device includes a base and a radiator mounted on the base. The base includes a rectangular body and four lugs extending outward from four corners of the body. Four buckles pre-assembled on four lugs. Each buckle includes a buckle and a set of springs on the buckle. The fastener is provided with a slot at its bottom, and a snap r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/12H05K7/20
CPCH01L23/427H01L23/3672H01L23/4006H01L23/467H01L2924/0002H01L2924/00
Inventor 鲁进杜娟
Owner FU ZHUN PRECISION IND SHENZHEN
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com