Fixing bracket and radiating device using same

Abstract

The invention relates to a fixing bracket which is used for fixing radiators of different sizes onto a heating electronic element. A plurality of groups of plug slots of different depths are arranged inside the fixing bracket, wherein each group of plug slots are extended upwards from the inside of the bottom of the fixing bracket and used for plugging the radiators of different sizes. The invention also relates to a radiating device which comprises the fixing bracket adapted to the radiators of different sizes and a radiator contained in the fixing bracket, wherein the plurality of groups of plug slots of different depths are arranged inside the fixing bracket; a plurality of mounting parts, which are matched with one group of plug slots, are arranged on the periphery of the radiator in a protruding manner; and the tops of the mounting parts prop against the fixing bracket. Compared with the prior art, the fixing bracket provided by the invention has stronger generality, because the plurality of groups of plug slots of different depths are arranged inside the fixing bracket, each group of plug slots are adapted to the radiators of the same size, and different radiating demands are met by adapting the fixing bracket to the radiators of different sizes.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a fixing frame. Background technique [0002] With the rapid development of the electronic industry, the computing speed of electronic components such as the central processing unit has been greatly increased, and the heat generated by them has also increased sharply. How to dissipate the heat of electronic components to ensure their normal operation has always been an issue in the industry. issues of importance. In order to effectively dissipate the heat generated by the CPU during operation, the industry usually installs a heat sink on the surface of the electronic component, so that the temperature of the electronic component itself can be maintained within a normal operating range. [0003] There are many common means for mounting the heat sink on the circuit board, among which, the fixing frame that can accommodate the heat sink and be fixed to the...

AI Technical Summary

Problems solved by technology

However, electronic components with different calorific values ​​require radiators with different heat dissipation performance. After the existing fixing frame is manufactured, it can only be applied to a fixed type of radiator. When different types of radiators are required for different heat dissipation requirements , had to redesign the mount

Therefore, the commonality of the existing fixed frame is not good, which is not conducive to energy reuse

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