The invention provides a heat
radiation assembly, having a first heat
radiation plate and a second heat
radiation piece. One end of the first heat radiation plate is connected to a driving
chip, and the second heat radiation piece is connected to the other end of the first heat radiation plate. The heat radiation piece is a hollow structure. The end part of the second heat radiation piece is respectively provided with a
refrigerant inlet and a
refrigerant outlet. The
refrigerant flows into the second heat radiation piece through the refrigerant inlet, and transmits low temperature to the firstheat radiation plate through the second heat radiation piece. The first heat radiation plate then transmits the low temperature to the driving
chip to cool down chips. The arrangement of a
copper pipe and a fixed aluminum plate for the refrigerant circulation is removed. The invention is advantageous in that the number of the heat radiation assemblies is small, contact
thermal resistance is smalland heat radiation efficiency is high, and thereby the
chip temperature can be effectively reduced; one end of the first heat radiation plate is connected to the driving chip, and the plate-shaped structure guarantees the connection stability and improves heat radiation efficiency, and thereby the
contact failure between the
copper pipe and the chip can be prevented; through the structure changeof the second heat radiation piece, the cooling demand of various chips can be met.