32results about How to "Meet different heat dissipation needs" patented technology

The invention relates to a fixing bracket which is used for fixing radiators of different sizes onto a heating electronic element. A plurality of groups of plug slots of different depths are arranged inside the fixing bracket, wherein each group of plug slots are extended upwards from the inside of the bottom of the fixing bracket and used for plugging the radiators of different sizes. The invention also relates to a radiating device which comprises the fixing bracket adapted to the radiators of different sizes and a radiator contained in the fixing bracket, wherein the plurality of groups of plug slots of different depths are arranged inside the fixing bracket; a plurality of mounting parts, which are matched with one group of plug slots, are arranged on the periphery of the radiator in a protruding manner; and the tops of the mounting parts prop against the fixing bracket. Compared with the prior art, the fixing bracket provided by the invention has stronger generality, because the plurality of groups of plug slots of different depths are arranged inside the fixing bracket, each group of plug slots are adapted to the radiators of the same size, and different radiating demands are met by adapting the fixing bracket to the radiators of different sizes.

The invention relates to a multi-application radiator. The multi-application radiator comprises water cooling systems, a terminal system and air cooling systems. The water cooling systems are connected with the two sides of the upper portion of the terminal system, and the air cooling systems are connected with the two sides of the lower portion of the terminal system. The multi-application radiator has the functions of water cooling and air cooling, can conduct water cooling heat dissipation and air cooling heat dissipation at the same time, meets different heat dissipation requirements of different parts of the same equipment, has the high pertinence and is better in heat dissipation effect. The water cooling systems of the multi-application radiator can achieve recycling of cooling water, the number of cooling conduction mechanisms can be adjusted as required, the amount of cooling water can be controlled as required, the cooing rate is high, the heat dissipation effect is good, thecost is low, and energy conservation and environment protection are achieved. The multi-application radiator is good in heat dissipation effect, can meet different heat dissipation requirements of different machines and facilities, and is broad in application range.

The invention relates to a manufacture method of columnar radiator, which mainly comprises main procedures such as (1) extraction and extrusion molding, (2) cutting into column shape, (3) continuous punching and milling mold and (4) tightly combining cooling fins. During extraction and extrusion molding, a strip extrusion mold with a plurality of parallel and adjacent slab blocks is formed by extraction and extrusion and is cut into single extrusion blocks. During cutting molding, the slab block is cut along the vertical direction to form a plurality of columnar bodies. During continuous punching and mold milling, a plurality groups of punching molds sequentially subject the plurality of columnar bodies to continuous coarse punching and fine punching to precise shape the columnar bodies. Accordingly, the cooling fins can be sequentially matched with and sheathed in the plurality of columnar bodies to fast assemble a columnar radiator.

The invention relates to a heat radiation bipolar plate of a fuel battery. The heat radiation bipolar plate comprises a cathode plate and an anode plate. The bipolar plate is characterized in that a heat radiation section is arranged between the cathode plate and the anode plate; the heat radiation section consists of a plurality layers of heat radiation plates which are overlapped in sequence; a plurality of parallel straight grooves are formed in the heat radiation plates; after the plurality layers of heat radiation plates are sequentially overlapped, fluid channels are formed by the parallel straight grooves between every two adjacent plates; an end hole I and an end hole II are formed in one ends of the parallel straight grooves which form the first layer of fluid channels and the last layer of fluid channels in the heat radiation section; the end hole I and the end hole II are exposed in air; the end hole I and the end hole II are respectively formed in two ends of the heat radiation section; two ends of the other parallel straight grooves in the heat radiation section are sealed. Compared with the prior art, the bipolar plate has the advantages that the heat radiation effect is good, the reliability is high, the mounting is convenient, heat radiation fins can be randomly combined, and the like.

The invention provides a heat radiation assembly, having a first heat radiation plate and a second heat radiation piece. One end of the first heat radiation plate is connected to a driving chip, and the second heat radiation piece is connected to the other end of the first heat radiation plate. The heat radiation piece is a hollow structure. The end part of the second heat radiation piece is respectively provided with a refrigerant inlet and a refrigerant outlet. The refrigerant flows into the second heat radiation piece through the refrigerant inlet, and transmits low temperature to the firstheat radiation plate through the second heat radiation piece. The first heat radiation plate then transmits the low temperature to the driving chip to cool down chips. The arrangement of a copper pipe and a fixed aluminum plate for the refrigerant circulation is removed. The invention is advantageous in that the number of the heat radiation assemblies is small, contact thermal resistance is smalland heat radiation efficiency is high, and thereby the chip temperature can be effectively reduced; one end of the first heat radiation plate is connected to the driving chip, and the plate-shaped structure guarantees the connection stability and improves heat radiation efficiency, and thereby the contact failure between the copper pipe and the chip can be prevented; through the structure changeof the second heat radiation piece, the cooling demand of various chips can be met.

The invention provides a double evaporator condenser loop heat pipe, which includes an evaporator, a radiator and a condenser. The condenser includes two condensers, namely a first condenser and a second condenser, an evaporator and a first condenser. Connected by the first steam line, the first condenser and the radiator are connected by the first liquid line, the radiator and the second condenser are connected by the second steam line or the thermal fluid line, the second condenser and the evaporator are connected Connect through the second liquid line. The present invention improves the current loop heat pipe, so that heat sources at different positions or heat sources with different temperatures are transferred through a loop heat pipe, so that the system structure is simple and the cost is saved.

An overlapped heat radiation structure comprises a bearing abutment, a supporting assembly, an overlapped assembly and a guide plate. The bearing abutment is provided with an installing surface. The supporting assembly comprises a supporting rod, a buffering ring and a locking ring, the supporting rod is arranged on the installing surface and sleeved with the buffering ring and the locking ring, the locking ring and the supporting rod are in threaded connection, and the locking ring abuts against the side surface, far away from the bearing abutment, of the buffering ring. The overlapped assembly is arranged on the installing surface and clamped between the buffering ring and the bearing abutment. The overlapped assembly is provided with a receding groove, and the supporting rod is located in the receding groove. The overlapped assembly comprises a plurality of overlapped plates which are overlapped. The guide plate is arranged on the installing surface and located in the receding groove, and the guide plate abuts against the inner side wall of the receding groove. In this way, different heat radiation loads can be adjusted correspondingly by adjusting the number of the overlapped plates of the overlapped assembly. In addition, the overlapped assembly is clamped between the buffering ring and the bearing abutment, and the overall structure stability is higher.

The present invention discloses casing with heat radiation gate and heat radiation gate. It contains one shell with at least one opening forming with two brackets, one heat radiation gate set between two brackets, said heat radiation gate including plurality of vane, one driving device and one motor, wherein each vane having one rotor shaft, said driving device interlocking vane synchronous rotation, said motor having one power-output shaft for driving said driving device; through said heat radiation gate controlling said opening size to obtain good heat radiation effect.

The present application relates to the technical field of vehicles, in particular to a cooling system, a control method and a vehicle, including: a first cooling branch, a second cooling branch and a supercharging device, the first cooling branch and the second cooling The branches are connected in parallel, the first cooling branch and the second cooling branch are provided with channels for cooling working fluid; the booster is used to adjust the pressure in the first cooling branch; the The first cooling branch circuit includes a first component to be cooled and a regulating valve connected in sequence; the second cooling branch circuit includes a pressure regulating device and a second component to be cooled in sequence. Cool the cylinder head and cylinder block respectively by designing the first cooling branch and the second cooling branch to meet the different heat dissipation requirements of the cylinder block and cylinder head; and adjust the heat dissipation of the cylinder block and cylinder head according to the load state of the engine , to realize the rapid change of the heat transfer and the wall surface temperature of the engine water jacket, and reach the optimum working temperature of the engine.