Server, onboard structure and multi-efficiency composite layer radiator

Abstract

The invention discloses a multi-efficiency composite layer radiator. The multi-efficiency composite layer radiator includes a heat conduction plate which is arranged in a case and abuts against the surface of a heating element, and a heat dissipation assembly which is arranged on the heat conduction plate for dissipating heat absorbed by the heat conduction plate, wherein the heat dissipation assembly comprises a plurality of fin groups with different heat dissipation efficiencies, and the distribution position of each fin group on the heat dissipation assembly corresponds to the distributionposition of a heat accumulation group in the case, so that the heat dissipation requirements of all positions in the case are respectively met. According to the multi-efficiency composite layer radiator, by arranging the fin groups with different distribution positions and different heat dissipation efficiencies on the heat dissipation assembly, areas with different heat distributions in the caseare subjected to heat dissipation respectively in a targeted mode, so that the comprehensive heat dissipation efficiency of the server is improved, and different heat dissipation requirements at different positions in the case are met while the situations of insufficient performance and excessive performance are avoided, and cost and performance are both considered. The invention also discloses anonboard structure and a server. The beneficial effects of the onboard structure and the server are as described above.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a multi-efficiency composite layer radiator. The invention also relates to a board structure and a server. Background technique [0002] With the development of electronic technology in China, more and more electronic devices have been widely used. [0003] A server is an important part of electronic equipment and a device that provides computing services. Since the server needs to respond to and process service requests, generally speaking, the server should have the ability to undertake and guarantee services. According to the different types of services provided by the server, it is divided into file server, database server, application server, WEB server, etc. The main components of the server include processors, hard disks, memory, system buses, etc., which are similar to general-purpose computer architectures, but due to the need to provide highly reliable servi...

AI Technical Summary

Problems solved by technology

[0005] At present, copper heat dissipation fins or aluminum heat dissipation fins are usually used on common radiators, the former has higher heat dissipation efficiency and the latter is lower, and the cost of copper is higher than that of aluminum

However, in actual use, due to the large number of electronic components in the chassis, the distribution of heat in the chassis is not uniform, and heat is often gathered in some places, but the heat dissipation is caused by the use of aluminum radiators with low heat dissipation efficiency. Insufficient performance, or excess thermal performance in heat-thin locations due to the use of more efficient copper heatsinks

All in all, the heat dissipation performance of the current radiators installed in the chassis usually does not match the actual cooling requirements in the chassis

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