Electronic device heat dissipation structure with three-dimensional net-shaped structure and manufacturing method

Abstract

The invention discloses an electronic device heat dissipation structure with a three-dimensional net-shaped structure and a manufacturing method. The electronic device heat dissipation structure comprises a heat dissipation plate, a multi-layer micron-sized net-shaped structure and a multi-layer framework. A plurality of layers of micron-sized net structures are arranged on the heat dissipation plate, a framework layer is arranged between every two adjacent layers of micron-sized net structures, the micron-sized net structures are modified with nano-sized microstructures, and the heat dissipation plate, the micron-sized net structures and the framework layers are all made of copper. On the microcosmic level, the supplementing capacity of liquid can be improved, and bubble disengagement isfacilitated, and on the macroscopic level, the heat exchange area can be increased, and the heat exchange capacity is enhanced.

Description

technical field [0001] The invention belongs to high heat flux boiling enhanced heat transfer technology, relates to an efficient cooling technology suitable for high heat flux microelectronic devices, in particular to a heat dissipation structure of electronic devices with a three-dimensional network structure and a manufacturing method. Background technique [0002] With the continuous improvement of the integration of electronic devices and the gradual reduction of feature size, the heat flux density of chips is getting higher and higher. The energy consumption and heat dissipation of chips will profoundly affect the entire information industry and even the global economy. The problem of chip thermal control directly affects the improvement of the reliability and integration of electronic devices, and the failure caused by heat has become the main form of failure of microelectronic devices. Boiling heat transfer is a violent vaporization process that converts the working ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies and defects of the existing enhanced surface structure for cooling high heat flux electronic devices, the present invention provides a heat dissipation structure and manufacturing method for electronic devices with a three-dimensional network structure

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