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Electronic device heat dissipation structure with three-dimensional net-shaped structure and manufacturing method

A network structure and three-dimensional network technology are applied in the field of heat dissipation structure and manufacturing of electronic devices to achieve the effects of increasing critical heat flux density, promoting bubble nucleation, and increasing effective heat exchange area

Active Publication Date: 2020-11-13
西安交通大学深圳研究院
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies and defects of the existing enhanced surface structure for cooling high heat flux electronic devices, the present invention provides a heat dissipation structure and manufacturing method for electronic devices with a three-dimensional network structure

Method used

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  • Electronic device heat dissipation structure with three-dimensional net-shaped structure and manufacturing method
  • Electronic device heat dissipation structure with three-dimensional net-shaped structure and manufacturing method
  • Electronic device heat dissipation structure with three-dimensional net-shaped structure and manufacturing method

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Embodiment Construction

[0045] The present invention is described in further detail below:

[0046] A heat dissipation structure of an electronic device with a three-dimensional network structure, comprising a heat dissipation plate 1, a multi-layer micron-scale network structure, and a multi-layer skeleton. The cooling plate 1 is provided with a multi-layer micron-scale network structure, and the nano-scale microstructure is decorated on the multi-layer micron-scale network structure (put the heat dissipation structure of the electronic device with the three-dimensional network structure into the modification liquid, and the multi-layer micron-scale network structure Nanoscale microstructures are grown on the hierarchical network structure). Wherein, the heat dissipation plate 1 and the multi-layer micron-scale mesh structure are made of copper, which has good thermal conductivity. The length and width of the heat dissipation plate 1 are both L1, and the value is 5-50mm; the multilayer micron-scale...

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Abstract

The invention discloses an electronic device heat dissipation structure with a three-dimensional net-shaped structure and a manufacturing method. The electronic device heat dissipation structure comprises a heat dissipation plate, a multi-layer micron-sized net-shaped structure and a multi-layer framework. A plurality of layers of micron-sized net structures are arranged on the heat dissipation plate, a framework layer is arranged between every two adjacent layers of micron-sized net structures, the micron-sized net structures are modified with nano-sized microstructures, and the heat dissipation plate, the micron-sized net structures and the framework layers are all made of copper. On the microcosmic level, the supplementing capacity of liquid can be improved, and bubble disengagement isfacilitated, and on the macroscopic level, the heat exchange area can be increased, and the heat exchange capacity is enhanced.

Description

technical field [0001] The invention belongs to high heat flux boiling enhanced heat transfer technology, relates to an efficient cooling technology suitable for high heat flux microelectronic devices, in particular to a heat dissipation structure of electronic devices with a three-dimensional network structure and a manufacturing method. Background technique [0002] With the continuous improvement of the integration of electronic devices and the gradual reduction of feature size, the heat flux density of chips is getting higher and higher. The energy consumption and heat dissipation of chips will profoundly affect the entire information industry and even the global economy. The problem of chip thermal control directly affects the improvement of the reliability and integration of electronic devices, and the failure caused by heat has become the main form of failure of microelectronic devices. Boiling heat transfer is a violent vaporization process that converts the working ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L21/48
CPCH01L23/367H01L23/3736H01L23/3735H01L21/4882
Inventor 张永海徐鹏卓魏进家
Owner 西安交通大学深圳研究院
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