Radiator cooling base and method for manufacturing the same

Abstract

A radiator, radiating base and manufacture thereof, wherein the radiating base includes a heat conductor having a containing space and an opening; the opening is located at one end of the containing space; wherein the heat conductor is made by a single pipe body through processing. The manufacture method of the radiating base includes: providing a heat conductor, two ends of the heat conductor are respectively an opening. The heat conductor is processed in order to enable the heat conductor to have different diameters; the big diameter part of the heat conductor is flattened and at least one of this opening of the heat conductor is sealed.

Description

technical field [0001] The present invention relates to a radiator, a heat dissipation base and a method for manufacturing a heat dissipation base, in particular to a radiator, a heat dissipation base and a method for manufacturing a heat dissipation base with good heat conduction performance. Background technique [0002] Due to the advancement of science and technology, various electronic products (such as central processing units and chipsets, etc.) tend to develop in the direction of functional improvement and size miniaturization. The electronic components used are highly integrated, and the heat dissipation requirements are also increasing. Performance directly affects the reliability and service life of electronic products. [0003] Taking the heat dissipation structure of the central processing unit as an example, a heat sink is usually bonded, fastened or welded on the central processing unit, and is in contact with the central processing unit to export and dissipat...

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Problems solved by technology

[0006] However, in this method, the upper cover 11T and the lower cover 11B of the flat heat pipe 11 need to be connected by welding, so the welding path is longer, so the welding reliability is relatively unstable, and the upper cover of the flat heat pipe 11 is formed. 11T and lower cover 11B need to use different molds, high welding technology and need to cooperate with jigs, so the process cost is relatively high

In addition, due to the limitation of the geometry of the upper cover 11T and the lower cover 11B of the flat heat pipe 11, they cannot be sintered at the same time, so that the first capillary structure 111 and the second capillary structure 112 do not have continuity, that is, the first capillary structure The connection between 111 and the second capillary structure 112 is discontinuous, which further reduces the heat dissipation performance of the heat sink 1

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