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A kind of electronic device heat dissipation structure with three-dimensional network structure and manufacturing method

A mesh structure and three-dimensional mesh technology are applied in the field of heat dissipation structure and manufacturing of electronic devices to achieve the effects of reducing mutual blockage, improving heat exchange efficiency and increasing heat exchange area.

Active Publication Date: 2022-07-19
西安交通大学深圳研究院
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  • Abstract
  • Description
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Problems solved by technology

[0004] Aiming at the deficiencies and defects of the existing enhanced surface structure for cooling high heat flux electronic devices, the present invention provides a heat dissipation structure and manufacturing method for electronic devices with a three-dimensional network structure

Method used

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  • A kind of electronic device heat dissipation structure with three-dimensional network structure and manufacturing method
  • A kind of electronic device heat dissipation structure with three-dimensional network structure and manufacturing method
  • A kind of electronic device heat dissipation structure with three-dimensional network structure and manufacturing method

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Embodiment Construction

[0045] The present invention is described in further detail below:

[0046] A heat dissipation structure of an electronic device with a three-dimensional network structure includes a heat dissipation plate 1, a multi-layer micron-level network structure, and a multi-layer skeleton. The heat dissipation plate 1 is provided with a multi-layer micro-scale network structure, and the multi-layer micro-scale network structure is decorated with a nano-scale micro structure (the heat dissipation structure of the electronic device with the three-dimensional network structure is put into the modification solution, and the multi-layer micro-scale network structure is modified with a nano-scale micro structure. growth of nanoscale microstructures on a scale network structure). Among them, the material of the heat dissipation plate 1 and the multi-layer micron-level network structure is copper, which has good thermal conductivity. The length and width of the heat dissipation plate 1 are b...

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Abstract

The invention discloses a heat dissipation structure of an electronic device with a three-dimensional network structure and a manufacturing method, comprising a heat dissipation plate, a multi-layer micron-level network structure and a multi-layer skeleton. Several layers of micron-level network structures are arranged on the heat dissipation plate, and a skeleton layer is arranged between two adjacent layers of micron-level network structures. The micron-level network structures are decorated with nano-level microstructures. , the micron-level network structure and the material of the skeleton layer are all copper. On the microscopic level, the invention can improve the replenishment capacity of the liquid and help the bubbles to escape; on the macroscopic level, the invention can increase the heat exchange area and enhance the heat exchange ability.

Description

technical field [0001] The invention belongs to the high heat flux density boiling enhanced heat exchange technology, relates to an efficient cooling technology suitable for high heat flux density microelectronic devices, and in particular relates to an electronic device heat dissipation structure with a three-dimensional network structure and a manufacturing method. Background technique [0002] As the degree of integration of electronic devices continues to increase, the feature size is gradually reduced, and the heat flux density of the chip is getting higher and higher. The energy consumption and heat dissipation of the chip will profoundly affect the entire information industry and even the global economy. The thermal control problem of the chip directly affects the improvement of the reliability and integration of electronic devices, and the failure caused by heat has become the main form of failure of microelectronic devices. Boiling heat transfer is a violent vaporiz...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/373H01L21/48
CPCH01L23/367H01L23/3736H01L23/3735H01L21/4882
Inventor 张永海徐鹏卓魏进家
Owner 西安交通大学深圳研究院
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