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Optical apparatus with adjustable action of force on optical module

A technology of optical equipment and optical modules, applied in the field of optical equipment and optical imaging equipment

Active Publication Date: 2014-03-12
CARL ZEISS SMT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, said relative frictional movement leads to the introduction of parasitic shear stress in the optical module, said deformation (due to the high stiffness of the system) also leads to large parasitic stresses in the optical module

Method used

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  • Optical apparatus with adjustable action of force on optical module
  • Optical apparatus with adjustable action of force on optical module
  • Optical apparatus with adjustable action of force on optical module

Examples

Experimental program
Comparison scheme
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no. 1 example

[0032] Refer below Figure 1 to Figure 3 A preferred embodiment of an optical device used in the optical imaging device 101 for microlithography according to the present invention is described.

[0033] To simplify the description, refer to figure 1 , 2A and the xyz coordinate system shown in 2B, where gravity is assumed to be applied in a direction parallel to the z-axis. It goes without saying, however, that in other variants of the invention, other arrangements of the components of the imaging device 101 may be applied.

[0034] figure 1 A schematic diagram of a preferred embodiment of an optical imaging apparatus according to the invention in the form of a microlithographic apparatus 101 operating with UV light having a wavelength of 193 nm is shown.

[0035] The microlithographic apparatus 101 comprises an illumination system 102 , a mask arrangement in the form of a mask table 103 , an optical projection system in the form of an objective lens 104 with an optical axi...

no. 2 example

[0104] Refer below figure 1 and Figure 4 Another preferred example embodiment of the optical device 201.1 according to the invention is described. Optical Devices 201.1 may be used in figure 1 The optical device 101.1 is replaced in the microlithographic device 101 in the optical device. The optical device 201.1 is basically the same in design and function as the optical device 101.1 of the first embodiment, so here we will mainly focus on their differences. Specifically, the same components are denoted only by reference numerals simply plus 100. In the following, reference is made to the above description with respect to the features and functions of these components unless stated to the contrary.

[0105] One difference between the optical device 201.1 and the optical device 101.1 is that the first connector part 210.1 of the respective connection unit 210 comprises only the second connector element 210.6, which in this case has a direct mechanical connection to the obj...

no. 3 example

[0118] Refer below figure 1 and Figure 5 , describing another preferred embodiment of the optical device 301.1 according to the invention. Optical Device 301.1 can be used in figure 1 The optical apparatus 101.1 is replaced in the microlithography apparatus 101 in the . The optical device 301.1 is substantially identical in design and function to the optical device 101.1 in the first exemplary embodiment, so that here we will mainly focus on their differences. In particular, the same components are denoted by reference numerals simply added by 200. In the following, reference is made to the above description with respect to the features and functions of these components unless stated to the contrary.

[0119] One difference between the optical device 301.1 and the optical device 101.1 is that in this example the first contact surface 310.3 and the second contact surface 310.4 are each surfaces with a double curvature. Therefore, the first contact surface 310.3 has a (fir...

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Abstract

The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.

Description

technical field [0001] The present invention relates to an optical device, an optical imaging device, including a device and a method for connecting an optical module to a support structure. The invention can be used in any optical device or method of optical imaging. In particular, the invention may be used in microlithography employed in the fabrication of microelectronic circuits. Background technique [0002] In particular, in the field of microlithography, in addition to using components designed with the highest possible precision, it is especially necessary to hold the optical modules of the imaging device (such as optical elements with objectives, mirrors and grids) during operation. module) such that they have the smallest possible deviation from the prescribed setting position or the prescribed setting geometry in order to obtain a correspondingly high imaging quality (wherein, in the meaning of the present invention, the term optical module can refer to individua...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G02B7/02
CPCG02B7/028G03F7/70975G03F7/70833G03F7/70816G02B7/003G03F7/70141
Inventor 关彦彬
Owner CARL ZEISS SMT GMBH