Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof

A negative temperature coefficient, thermistor technology, applied in the direction of resistors with negative temperature coefficient, resistance manufacturing, resistors, etc., can solve the problems of multi-layer NTC thermistors that have not yet been seen

Inactive Publication Date: 2013-03-20
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The resistance value can be reduced by printing internal electrodes, but so far there has been no relevant report on making low-resistance multi-layer laminated NTC thermistors by printing internal electrodes

Method used

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  • Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof
  • Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof
  • Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof

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Embodiment Construction

[0045] The present invention will be described below in conjunction with specific embodiments and with reference to the drawings.

[0046] Kind of like Figure 1~4 The low-resistance chip type negative temperature coefficient thermistor shown in the horizontal structure is made into a surface-mounted structure using a printed circuit board process, including an NTC thermistor chip and terminal electrodes 4. The manufacturing method includes an NTC thermistor chip manufacturing method and a terminal electrode manufacturing method.

[0047] The manufacturing method of NTC thermistor chip includes the manufacturing of multilayer laminated sheet blanks, and the steps of sequentially lamination from bottom to top are as follows;

[0048] 1) Stack a piece of green film 3 printed with cutting dimension lines;

[0049] 2) Stack the lower substrate composed of n1=9 blank green film 1 and a green film 2 printed with internal electrodes on the surface of a blank green film 1 at the end, n1=9 is...

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Abstract

The invention discloses a low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with a horizontal structure and a manufacturing method thereof, wherein the method comprises the step of manufacturing multilayer lamination blanks, and further comprises the steps of laminating sequentially from bottom to top as below: (1) stacking a blank film printed with cutting size lines; (2) stacking a lower substrate which is composed of n1 empty blank films and one internal electrode-printed blank film on the surface of an end empty blank film; (3) stacking m groups of m intermediate barrier layers composed of n2 empty blank films and one internal electrode-printed blank film on the surface of the end empty blank film, wherein m is determined by a set resistance value of the thermal resistor; and (4) stacking an upper substrate composed of n3 empty blank films. The product provided by the invention is in a horizontal structure, the resistance value of the thermal resistor can be flexibly adjusted within a range of low resistance values by setting the area of the internal electrodes, the number of the blank films printed with the internal electrodes and the total thickness of the intermediate barrier layers, and the low-resistance-value multilayered lamination-type NTC (Negative Temperature Coefficient) thermal resistor can be manufactured.

Description

Technical field [0001] The invention relates to a thermistor, in particular to a low-resistance sheet-type negative temperature coefficient thermistor with a horizontal structure adopting a stacking process and a manufacturing method thereof. Background technique [0002] Low-resistance chip negative temperature coefficient (NTC) thermistors, which are widely used in micro-fine circuits, are mostly manufactured by doping other elements to adjust material formulations to reduce material resistivity. The resistance value can be reduced by printing the internal electrodes, but there is no relevant report on the production of low-resistance multilayer NTC thermistors by printing the internal electrodes. Summary of the invention [0003] A technical problem to be solved by the present invention is to make up for the above-mentioned defects of the prior art and provide a low-resistance chip type negative temperature coefficient thermistor with a horizontal structure. [0004] Another tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C17/00H01C17/065
Inventor 康建宏包汉青潘士宾冷东贾广平
Owner SHENZHEN SUNLORD ELECTRONICS
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