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Circuit substrate and package of light emitting diode

A technology for light-emitting diodes and encapsulation colloids, which is applied to circuits, electrical components, electrical solid-state devices, etc., can solve the problem of high manufacturing cost of conductive structures, and achieve the effects of low manufacturing cost and high arrangement density.

Active Publication Date: 2011-08-03
EVERLIGHT ELECTRONICS (CHINA) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the fabrication cost of the conductive structure is higher

Method used

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  • Circuit substrate and package of light emitting diode
  • Circuit substrate and package of light emitting diode
  • Circuit substrate and package of light emitting diode

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Embodiment Construction

[0057] Figure 3A versus Figure 3B Is a schematic diagram of a circuit substrate according to an embodiment of the present invention, Figure 4 ~ Figure 11 for Figure 3A Schematic diagram of various variations of the circuit board.

[0058] Please refer to Figure 3A The circuit substrate L of this embodiment includes a base layer F and a plurality of pin units 300 arranged in an array, wherein the pin units 300 are all disposed on the base layer F, and the pin units 300 arranged in the array refer to the pins The cells 300 are arranged in multiple rows and multiple columns on the base layer F. The base layer F has a plurality of counterbores F1. Each pin unit 300 includes a shared terminal 310 and at least three pins 320, and in this embodiment, each pin unit 300 has four pins 320. The shared terminal 310 is divided into a plurality of electrodes E connected to each other. The pins 320 extend outward from the edge of the shared terminal 310, and each pin 320 extends outward ...

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Abstract

The invention relates to a package of a light emitting diode, which comprises a carrying device, a chip of the light emitting diode, and packaging colloid, wherein the carrying device comprises a carrying plate, a first electrode, a first pin, a second electrode and a second pin; the first electrode, the first pin, the second electrode and the second pin are all arranged on the carrying plate, and the carrying plate is provided with two counter bores to expose the first electrode and the second electrode respectively; the first pin is connected with the edge of the first electrode; the second pin is connected with the edge of the second electrode; the chip of the light emitting diode is arranged on the first pin, and is electrically connected with the first pin and the second pin; and the packaging colloid is arranged on the carrying plate, and covers the first pin, the second pin and the chip of the light emitting diode, the packaging colloid is provided with two counter bores to expose the first electrode and the second electrode respectively, both the first electrode and the second electrode have two cutting edges which are adjacent to each other and located at corners, and the two cutting edges are not in parallel to each other.

Description

[0001] This case is a divisional application with the application number of 200810100702.1. Technical field [0002] The present invention relates to a circuit substrate and a light-emitting diode package, and particularly relates to a circuit substrate and a light-emitting diode package with a lower manufacturing cost. Background technique [0003] Compared with traditional light bulbs, light-emitting diodes have the characteristics of small size, long life, power saving, and no mercury pollution. Therefore, as the luminous efficiency of light-emitting diodes continues to increase, light-emitting diodes have gradually replaced fluorescent lamps and incandescent lamps in certain fields. For example, scanner light sources that require high-speed response, liquid crystal display (LCD) backlights, automobile instrument panels (instrument panels) light sources, traffic signal lights, and certain lighting devices have all adopted luminescence. diode. [0004] figure 1 It is a three-dim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L33/48H01L33/62
CPCH01L2224/48091H01L2224/48247H01L2924/00014
Inventor 邹文杰
Owner EVERLIGHT ELECTRONICS (CHINA) CO LTD
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