Planar optical waveguide vibrating sensor chip cantilever beam manufacturing method

Abstract

Provided is a planar optical waveguide vibrating sensor chip cantilever beam manufacturing method. A water assisting femtosecond laser machining method is used for machining a cantilever beam on a planar optical waveguide splitter chip, a pair of equal-length longitudinal grooves is formed in the two sides of each input splitter optical waveguide strip in parallel in a digging mode respectively, then a bottom gap is formed below a core layer zone where the input splitter optical waveguide is placed in a cutting mode, so that longitudinal grooves in the two sides are communicated in the bottom, then a horizontal groove communicated with the longitudinal grooves in the two sides is formed in the front ends of the longitudinal grooves in the two sides in a digging mode, and the cantilever beam which can vibrate freely is formed in the middle zone defined by the longitudinal grooves, the horizontal groove and the bottom gap. The cantilever beam with large size can be machined, the size of the cantilever beam is at the micron magnitude order or the millimeter magnitude order, and a manufactured planar optical waveguide vibrating sensor chip can respond to high-frequency wave band mechanical vibration and low-frequency wave band mechanical vibration.

Description

technical field [0001] The invention relates to an optical waveguide vibration sensor, in particular to a method for manufacturing a planar optical waveguide vibration sensor chip cantilever beam. Background technique [0002] Traditional vibration sensors generally use electrical sensors, which are difficult to work in environments with strong electromagnetic interference, high temperature and humidity, and high pressure, and are not suitable for long-distance sensing. [0003] Optical waveguide vibration sensors have been used to overcome the shortcomings of electrical sensors, and the majority of optical waveguide vibration sensors are in the form of cantilever beams. The existing cantilever beam processing method is an etching method, usually silicon etching is performed on the optical waveguide structure based on the silicon substrate, and the optical waveguide cantilever beam structure is processed. However, the silicon material has low mechanical strength and is easy...

AI Technical Summary

Problems solved by technology

However, the silicon material has low mechanical strength and is easy to damage, and the silicon etching method can only process small-sized cantilever beams, which are generally on the order of hundreds of nm to several μm. Low frequency band responds to mechanical vibration

For the optical waveguide chip on the glass substrate, the optical waveguide cantilever beam structure cannot be prepared by pure etching method at present.

And the silicon substrate-based optical waveguide chip used by the pure etching method is not compatible with the standard optical fiber connection packaging process

The PLC optical waveguide chip prepared on the glass substrate is compatible with the standard optical fiber packaging process, but the optical waveguide cantilever beam structure cannot be prepared by pure corrosion method

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