Wafer drying system
A drying system and wafer technology, applied in drying, drying machines, progressive drying machines, etc., can solve the problems of high power consumption, easy deformation, scrapping, etc., and achieve the effect of reducing hot air temperature and wind speed
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0027] In the description of the present invention, the orientation or positional relationship indicated by the terms "inner", "outer", "upper", "lower", "upstream", "downstream" etc. are based on the orientation or positional relationship shown in the drawings, The disclosure is merely for convenience in describing the invention and does not require that the invention must be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. In the description of the present invention, the ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com