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Multipoint dispensing process and LED (light emitting diode) device

A technology for LED devices and dispensing technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven distribution of phosphors on the surface of the chip, uneven distribution of phosphor glue, affecting the uniformity of light output, etc. Excitation efficiency, increased contact area, good uniformity of light output

Active Publication Date: 2011-08-10
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for power-type LEDs with smaller-sized brackets and LEDs with "dam" dispensing methods for flat-panel brackets, it is difficult to control the amount of glue in the packaging process. For example, when the viscosity of phosphor glue is small, phosphor glue and easy Flow out of the surface of the "dam", causing the fluorescent powder tape to flow out together with the fluorescent powder, making the phosphor distribution on the chip surface uneven, and yellow or blue circles appear. The uneven distribution of phosphor glue affects the uniformity of light output. Moreover, the position of the gold wire will have a greater traction force on the phosphor powder glue. And affect the uniformity of light; the spraying method can indeed solve the dispensing problem of the flat-plate bracket well, but the cost of the equipment is relatively expensive, thereby increasing the packaging cost

Method used

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  • Multipoint dispensing process and LED (light emitting diode) device
  • Multipoint dispensing process and LED (light emitting diode) device
  • Multipoint dispensing process and LED (light emitting diode) device

Examples

Experimental program
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Effect test

Embodiment 1

[0031] The manufacture of the above LED devices is completed by a multi-point dispensing process, and the specific steps are as follows:

[0032] (1) Perform dehumidification treatment on the bracket 1 before die bonding.

[0033] (2) Fix the chip 2 on the support 1 through silver glue, and fix it by baking to complete the fixing operation;

[0034] (3) Weld the positive and negative poles of the chip 2 to the support 1 through the gold wire 3 .

[0035] (4) Use the automatic glue dispensing equipment to put the fluorescent powder glue on the surface of the chip in multiple points. The distance between adjacent fluorescent powder glue points is 10-1000 μm, and 10 μm is selected in this embodiment; wherein, phosphor powder and glue are added to the glue mixing container according to the ratio of 1.5:1 to 1:1000, and the centrifugal mixer After stirring and vacuumizing, the degree of vacuum during vacuuming is 0.01-1000 Pa, and 0.01 Pa is selected in this embodiment.

[0036]...

Embodiment 2

[0039] The manufacture of the above LED devices is completed by a multi-point dispensing process, and the specific steps are as follows:

[0040] (1) Perform dehumidification treatment on the bracket 1 before die bonding.

[0041] (2) The chip 2 is fixed on the support 1 by silver glue, and fixed by baking to complete the fixing operation.

[0042] (3) Weld the positive and negative poles of the chip 2 to the support 1 through the gold wire 3 .

[0043] (4) Use the automatic glue dispensing equipment to put the fluorescent powder glue on the surface of the chip in multiple points. The distance between adjacent fluorescent powder glue points is 10-1000 μm, and 1000 μm is selected in this embodiment, and no phosphor powder glue is placed at the position of the gold wire; wherein, the phosphor powder glue is composed of phosphor powder and glue according to the ratio of 1.5:1 to 1: The ratio of 1000 is added to the glue mixing container, and it is formed after being stirred and...

Embodiment 3

[0047] The manufacture of the above LED devices is completed by a multi-point dispensing process, and the specific steps are as follows:

[0048] (1) Perform dehumidification treatment on the bracket 1 before die bonding.

[0049] (2) The chip 2 is fixed on the support 1 by silver glue, and fixed by baking to complete the fixing operation.

[0050] (3) Weld the positive and negative poles of the chip 2 to the support 1 through the gold wire 3 .

[0051] (4) Use the automatic dispensing equipment to put the fluorescent powder glue on the surface of the chip in multiple points. The distance between adjacent fluorescent powder glue points is 10-1000 μm, and in this embodiment, 520 μm is selected, and no fluorescent powder glue is placed at the position of the gold wire; wherein, the fluorescent powder glue is composed of phosphor powder and glue according to the ratio of 1.5:1 to 1: The ratio of 1000 is added to the glue mixing container, and it is formed after being stirred and ...

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Abstract

The invention discloses a multipoint dispensing process and an LED (light emitting diode) device. The dispensing process sequentially comprises the steps of dehumidifying, die bonding, multipoint dispensing on a chip, heating and curing. The LED device comprises a bracket; the bracket is provided with a chip; and a fluorescent powder glue layer formed by a multipoint dispensing method is arranged on the chip. According to the LED device formed by the dispensing method disclosed by the invention, the fluorescent powder glue is uniformly distributed, the luminous efficiency of the LED device is high, and the uniformity and color temperature consistency of the luminous light spots of the LED device are good.

Description

technical field [0001] The invention relates to the packaging field of LEDs, in particular to a process of multi-point glue dispensing and an LED device formed by using the multi-point glue dispensing process. Background technique [0002] At present, white light LEDs are mainly produced by blue light chips plus phosphor excitation. The manufacturing process involves the dispensing of phosphor powder. The dispensing method of phosphor powder is directly related to the parameters of light extraction efficiency, uniformity of light emission, correlated color temperature and color rendering index. . For power-type LEDs, considering factors such as heat dissipation, luminous efficiency, and light output structure, flat-shaped brackets without bowl cups are often used. For the packaging process of flat-shaped brackets, ordinary injection and spraying types with "dams" are mainly used. Two types: 1. The so-called injection type with "dam" refers to adding a "dam" of transparent c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/52H01L33/50
Inventor 蔡永义雷海娜麦镇强洪琴王跃飞吴乾李国平
Owner HONGLI ZHIHUI GRP CO LTD
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