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Method and device for arranging matrix array assembly

A technology of matrix columns and components is applied in the field of components and devices of matrix column components, which can solve the problems of wasting component placement time and reducing production efficiency, and achieve the effect of saving component placement time.

Inactive Publication Date: 2011-08-10
WELLAND INDUSTRIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in a light-emitting diode device, the surface of the substrate usually has a plurality of repeated and identical light-emitting diodes, and the light-emitting diodes are arranged on the substrate in a matrix at equal intervals, which highlights that the known surface mount technology can only rely on Sequential and individual parts placement actions cause waste of part placement time and reduce production efficiency

Method used

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  • Method and device for arranging matrix array assembly
  • Method and device for arranging matrix array assembly
  • Method and device for arranging matrix array assembly

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Embodiment Construction

[0028] see figure 2 , the present invention provides a kind of inserting method of matrix column component, comprises steps and has:

[0029] S101, providing a substrate (PCB or FPC), where a control circuit is arranged on the substrate.

[0030] S103, using a solder paste printing machine to form a plurality of pads (Pads) on the substrate, the pads are electrically connected to the control circuit, and the position of the pads corresponds to the position on the substrate where the component is to be placed, so as to adhere and fix the component to the substrate superior. The solder pad is mainly composed of tin powder, flux and anti-sagging agent, and the solder pad can also be called solder. The particle size and composition of tin powder affect the melting point temperature and solderability of the solder pad. Smaller and more uniform tin powder has better fluidity and is easier to form.

[0031] S105, using an optical positioning device to identify the position of the...

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PUM

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Abstract

The invention relates to a method for arranging a matrix array assembly, which comprises the following steps of: providing a base plate; forming a plurality of solder pads on the base plate by using a tin paste printer; providing a plurality of assembly row groups, wherein each assembly row group is provided with a plurality of assemblies; attracting the assembly row groups by using a mechanical arm, and simultaneously arranging the assemblies on the solder pads to form the repeated irregular matrix array assembly; and introducing the base plate on which the repeated irregular matrix array assembly is placed to a reflow oven. Therefore, the mechanical arm attracts the assemblies and simultaneously arranges the assemblies on the base plate every time so as to save arrangement time. In addition, the invention also provides a device for arranging the matrix array assembly.

Description

technical field [0001] The present invention relates to a method for placing components in a matrix column and a device for placing components in a matrix column, especially to a method for placing components on a substrate and a method for placing components on a substrate in Surface Mount Technology. Placement device. Background technique [0002] Light emitting diodes (LEDs) have the advantages of thinness, power saving, shock resistance, fast response, long life and high color saturation. Therefore, light-emitting diodes have been widely used in screen displays or lighting devices as light sources for display and illumination. For example, the backlight of liquid crystal display, the backlight and button light source of mobile phone, as well as the lamp and instrument panel of automobile, etc. can all see the application of light emitting diode. [0003] see figure 1 , the LCD backlight module uses surface mount technology (Surface Mount Technology, SMT) to place and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/02
Inventor 蔡坤南李福田
Owner WELLAND INDUSTRIAL CO LTD
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