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Low temperature curing compositions

A composition and compound technology, applied in the direction of organic material conductors, chemical instruments and methods, non-metallic conductors, etc.

Active Publication Date: 2011-08-10
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] To date, no such type of composition is believed to have been reported or observed

Method used

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  • Low temperature curing compositions
  • Low temperature curing compositions
  • Low temperature curing compositions

Examples

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Embodiment

[0162] The curable compositions are listed in Table 1 below, the components having the indicated amounts of each in grams were mixed together at room temperature for about 10-15 minutes.

[0163] Table 1

[0164]

[0165] 1 X-BMI (1,20-bismaleimide derivative of 10,11-dioctyl-eicosane), prepared according to the procedure described in US 5,973,166, the disclosure of which is incorporated herein by reference.

[0166] Sample Nos. 1-3 are within the scope of the present invention, while Sample Nos. 4 and 5 are for comparison purposes.

[0167] An aliquot of each sample was placed on a substrate, a silicon die was placed on the aliquot, and the assembly was cured at 160°C for 30 minutes.

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Abstract

The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal / carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100 DEG C, for instance 55-70 DEG C, over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.

Description

technical field [0001] The present invention relates to thermosetting resin compositions comprising maleimide-, nadimide- or itaconimide-containing compounds, and metal / carboxylates and peroxides, which can Curing is at a low temperature for a relatively short period of time, for example at less than about 100°C, for example in the range of 55-70°C, for example within a period of about 30 to 90 minutes. Background technique [0002] Thermosetting resins are commonly used in adhesive formulations due to their excellent performance characteristics, which can be achieved by forming a fully cross-linked three-dimensional network. These properties include cohesive bond strength, resistance to thermal and oxidative attack, and low moisture absorption. As a result, common thermosetting resins such as epoxy resins, bismaleimide resins, and cyanate ester resins have been used in a wide variety of applications ranging from structural adhesives (such as construction and aerospace appl...

Claims

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Application Information

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IPC IPC(8): C08K5/3415C08K5/3417C08K3/10C08K5/14C08K5/09C08L9/00C08L33/08
CPCC08K5/3417C08K5/14C08K5/3415C08L9/00C08K3/10C08L15/00C08L2666/08B32B37/02B32B37/12B32B37/14C08F122/40C08K5/56C08L39/00H01B1/12
Inventor 白洁S·K·古普塔
Owner HENKEL KGAA