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Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC)

A touch and test machine technology, applied in the field of MCU and touch IC combined package programming and testing, can solve problems such as increasing test time and consuming equipment, and achieve the effect of reducing loss rate and saving test time

Active Publication Date: 2011-08-17
SUZHOU PIXCIR MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above method not only uses the programmer but also the test machine, so the test time is increased and the equipment is consumed

Method used

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  • Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC)
  • Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC)
  • Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC)

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Embodiment Construction

[0009] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0010] Please refer to figure 1 As shown, the MCU and touch IC combination packaging product 1 described in the present invention, wherein, the internal connection pins of the MCU and the touch IC are not drawn out of the package, and are called internal pins, such as the pins drawn from the touch IC. Pin A1; and for the pins directly drawn from the MCU and touch IC in the packaged product, these test pins are called external pins, such as the pin B1 drawn from the MCU. The burning test method for combined packaged products will be discussed in detail below.

[0011] Please refer to figure 2 As shown, first write the corresponding program according to the function that needs to be realized by the MCU, and in the present invention, the MCU needs to realize the corresponding communication between the external pin and the internal pin of the touch IC; ...

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Abstract

The invention discloses a burning test method of the combination and encapsulation of a microprogrammed control unit (MCU) and a touch integrated circuit (IC). The method comprises a tester, and comprises the following steps: compiling a burning program; converting the burning program into a binary system pattern; and placing the combined and encapsulated product on the tester and carrying out burning test. The test method provided by the invention is simple, test personnel can perform burning directly according to the burning program through the tester without burning the combined product in advance. in the method, the combined product does not need burning in advance, test time is saved; moreover, a burner is not used, thereby lowering the loss rate of the equipment.

Description

technical field [0001] The invention relates to an integrated method for programming and testing, in particular to a method for combining and packaging an MCU and a touch IC for programming and testing. Background technique [0002] Nowadays, with the continuous acceleration of the pace of society, customers have more and more strict requirements on the test time of touch chips, that is, touch ICs. In order to meet the needs of customers, manufacturers of touch ICs need to complete a Product test items. In the existing method, the combination test of MCU (memory controller) and touch IC generally requires the use of programmers and testers, because for combined packaging products, the number of pins is effectively reduced according to customer requirements, and some touch The pins connected to the IC and the MCU are not pulled out, so the internal pins must be tested through the conversion of the external pins of the MCU. Specifically, a specific program is poured into the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 章国平鲍盛萍郑向伟涂鄂钟
Owner SUZHOU PIXCIR MICROELECTRONICS