Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Light mixing type light-emitting diode encapsulation structure capable of improving color rendering

A technology of light-emitting diodes and packaging structures, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., to achieve the effect of increasing luminous efficiency and improving color rendering

Active Publication Date: 2012-11-28
PARAGON SEMICON LIGHTING TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ballasts of general energy-saving light bulbs and energy-saving lamp tubes are fixed. If the old ones are to be replaced with new ones, the ballasts must be discarded together. After coating, it will still inevitably cause serious pollution to the environment after being discarded

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light mixing type light-emitting diode encapsulation structure capable of improving color rendering
  • Light mixing type light-emitting diode encapsulation structure capable of improving color rendering
  • Light mixing type light-emitting diode encapsulation structure capable of improving color rendering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] In addition, the frame unit 3 has at least two surrounding frame adhesives 30 formed on the upper surface of the substrate body 10 by coating, wherein the at least two surrounding frame adhesives 30 surround the at least one first light-emitting module respectively. 2a and the above-mentioned at least one second light-emitting module 2b to respectively form at least two colloid limiting spaces 300 above the substrate body 10 . In addition, according to different design requirements, the at least two surrounding frame adhesives 30 can be selectively separated from each other or connected together, and the at least two surrounding frame adhesives 30 can be connected in series or in parallel. Taking the example of the first embodiment of the present invention, the at least two surrounding frame adhesives 30 are separated from each other by a predetermined distance, and the at least two surrounding frame adhesives 30 are arranged in parallel on the substrate body 10 .

[00...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a light mixing type light-emitting diode encapsulation structure capable of improving color rendering, which comprises a substrate module, a light-emitting unit, a frame unit and an encapsulation unit, wherein the light-emitting unit is provided with a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature; the frame unit is provided with two encircling frame colloids which are encircled on the upper surface of a substrate body in a coating mode, and the two encircling frame colloids surround the first light-emitting module and the second light-emitting module respectively to form two colloid limit spaces positioned above the substrate body respectively; and the encapsulation unit is provided with a first light-transmission encapsulation colloid and a second light-transmission encapsulation colloid which are formed on the upper surface of the substrate body to cover the first light-emitting module and the second light-emitting module respectively, and the first light-transmission encapsulation colloid and the second light-transmission encapsulation colloid are limited in the two colloid limit spaces. Therefore, the light mixing type light-emitting diode encapsulation structure capable of improving the color rendering can be generated.

Description

technical field [0001] The invention relates to a light-mixing light-emitting diode packaging structure, in particular to a light-mixing light-emitting diode packaging structure capable of improving color rendering. Background technique [0002] The invention of electric light can be said to have completely changed the way of life of all human beings. If we live without electric light, all work will stop at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age. [0003] Therefore, the lighting equipment used in the market today, such as fluorescent lamps, tungsten lamps, and even the energy-saving light bulbs that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high power consumption, high h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/13
CPCH01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/2612H01L2924/00014H01L2924/00
Inventor 吴朝钦钟嘉珽
Owner PARAGON SEMICON LIGHTING TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products