Precise leveling device of thick glue film

Abstract

The invention discloses a precise leveling device of a thick glue film, comprising a base (1) and a digital display unit, wherein an upright column component (5) is arranged at the rear part on the base (1); the base (1) is internally provided with a sheet-bearing unit (9), and the top part of the sheet-bearing unit (9) protrudes out of the upper surface of the base (1); the front side of the upright column component (5) is provided with a vertical feeding unit (4) which is provided with a cross beam (6), and the front end of the cross beam (6) extends to be above the sheet-bearing unit (9); the cross bream (6) is provided with a transverse feeding unit (7); and the lower part of the transverse feeding unit (7) is provided with a glue film screeding unit (8) which is provided with an air tap (8). In the precise leveling device, the structure is simple and compact, the manufacturing cost is low, the working efficiency is high, the practicability is strong, and the problems of uneven surface of the thick glue film and difficulty in accurate control of the thickness of the glue film can be better solved.

Description

technical field [0001] The invention belongs to precision machinery, in particular to a thick rubber film precision leveling device. Background technique [0002] Micro-scale components (such as micro-channels, micro-probes, micro-reaction cells, etc.) and micro-scale metal molds (such as micro-gear molds, etc.) have extensive and critical Applications, and its high-quality manufacturing has always been one of the technical difficulties in the field of micro and precision manufacturing. LIGA (German Lithographie, Galanoformung and Abformung, the abbreviations of lithography, electroforming and injection molding), UV (ultraviolet light)-LIGA and Laser (laser)-LIGA and other technologies are currently carrying these microstructures and parts, The main enabling technology for micromold fabrication tasks. Their common process feature is: need to use thick glue (such as PMMA (polymethacrylic resin), SU-8 glue or AZ glue, etc.) to prepare thick glue mold. However, due to the hi...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the deficiencies in the prior art, the present invention provides a thick adhesive film precision leveling device with low cost, high processing efficiency, which can effectively solve the problems of uneven surface of the adhesive film and difficulty in accurately controlling the thickness.

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