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Compositions with improved sealing characteristics for mold-in-place gaskets

A composition, mold technology, applied in the field of molded-in-place gasket composition, forming the field of molded-in-place gasket, can solve the problem of lowering, compressibility or other unsatisfactory physical properties

Inactive Publication Date: 2011-08-24
HENKEL US IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Often, techniques to improve the modulus, sealing force and / or tensile strength have resulted in an undesirable reduction in the compressibility or other physical properties

Method used

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  • Compositions with improved sealing characteristics for mold-in-place gaskets
  • Compositions with improved sealing characteristics for mold-in-place gaskets
  • Compositions with improved sealing characteristics for mold-in-place gaskets

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Example 1 - Higher Levels of Active Fumed Silica

[0065] In Table 1 below, two samples have been formulated. Composition A is a formulation that includes higher levels of active fumed silica and lower levels of traditional fumed silica, while composition B includes lower amounts of active fumed silica and lower levels of traditional fumed silica. High level of traditional fumed silica. The composition was shaped and mold-injected.

[0066] Table 1 - Composition Formulations

[0067]

[0068] (1) RC220C and XX013C available from Kaneka Corporation

[0069] (2) Irganox B-215 available from Ciba

[0070] (3) Plasthall DBEEEG available from HallStar Company

[0071] (4) Aerosil R7200 available from Evonik Industries

[0072] (5) HDK-H2000 available from Wacker Chemical Corporation

[0073] (6) Irgacure 2022 available from Ciba

[0074] Table 2 below shows the results of the various tests performed on gaskets made of Composition A and Composition B, respectively. ...

Embodiment 2

[0077] Example 2 - Compositions Including Plasticizers

[0078] In Table 3 below, two samples have been formulated. Composition C is a formulation including a plasticizer, while composition D does not include a plasticizer. These compositions were shaped and mold injected.

[0079] table 3

[0080]

[0081] (1) RC220C available from Kaneka Corporation

[0082] (2) Irganox B-215 available from Ciba

[0083] (3) Plasthall DBEEEG available from HallStar Company

[0084] (4) Aerosil R7200 available from Evonik Industries

[0085] (5) HDK-H2000 available from Wacker Chemical Corporation

[0086] (6) Irgacure 2022 available from Ciba

[0087] The formed gaskets were then tested for their respective glass transition temperature levels. The results are shown in Table 4 below.

[0088] Table 4 - Results of glass transition temperature tests

[0089]

[0090] As can be seen, the composition including plasticizer (Composition C) has a much lower glass transition temperatu...

Embodiment 3

[0091] Example 3 - Comparative Composition

[0092] Tables 5 and 6 below compare eight different compositions (E-L) containing varying amounts of plasticizer and silica. Compositions E-L were shaped and exposed to actinic radiation to test their various properties.

[0093] Table 5 - Comparative Compositions (E-H)

[0094]

[0095] (1) RC220C available from Kaneka Corporation

[0096] (2) XX013C available from Kaneka Corporation

[0097] (3) Irganox B-215 available from Ciba

[0098] (4) Plasthall DBEEEG available from the HallStar Company

[0099] (5) Aerosil R7200 available from Evonik Industries

[0100] (6) HDK-H2000 available from Wacker Chemical Corporation

[0101] (7) Irgacure 2022 available from Ciba

[0102] Table 6 - Comparative Compositions (I-L)

[0103]

[0104] (1) RC220C available from Kaneka Corporation

[0105] (2) XX013C available from Kaneka Corporation

[0106] (3) Irganox B-215 available from Ciba

[0107] (4) Plasthall DBEEEG available f...

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Abstract

The present invention relates to compositions with improved sealing characteristics for mold-in-place gaskets, and a process for forming a mold-in-place gasket by liquid injection molding. More particularly, the present invention relates to a mold-in-place gasket composition incorporating (meth)acrylate-functionalized silica, plasticizers, or both, with improved modulus and sealing properties, and a process for forming such mold-in-place gasket.

Description

technical field [0001] The present invention relates to compositions having improved sealing properties for mold-in-place gaskets, and methods of forming mold-in-place gaskets by liquid injection molding. More particularly, the present invention relates to mold-in-place gasket compositions incorporating (meth)acrylate functionalized silica, plasticizers, or both, which have improved modulus and sealing properties, as well as forming such Method of molding gaskets in place. Background technique [0002] Heretofore, mold-in-place gaskets have been shaped by liquid injection of a gasket-forming material into a mold. Typical methods involve the use of high temperature and / or high pressure fluid injection. Typical methods are described, for example, in US Patent No. 5,597,523 to Sakai et al. The molding process and molding equipment required the use of both elevated pressures of 24,500 kPa (3,500 psig) and elevated temperatures of 250°C (480°F). The upper and lower molds are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/08C08K3/36C08K9/04C08L5/12B29C45/00
CPCC08K3/34C08K9/04C08L33/08B29C45/0001C08L2205/02C08L2666/04B29C45/00C08F290/04C08K3/36
Inventor A·A·德卡托J·E·莱恩比尔格
Owner HENKEL US IP