Soldering flux

Abstract

The invention discloses soldering paste and a soldering flux thereof, and preparation methods thereof. The soldering paste comprises lead-free soldering powder and the soldering flux, wherein the soldering flux comprises the following raw materials in percentage by weight: 6-15 percent of polyisobutene or polybutylene, 3-10 percent of imidazoles compound, 15-45 percent of rosin, 3-15 percent of thixotropic agent, 3-15 percent of active agent and the balance of solvent; therefore, through adding at least one of polyisobutene or polybutylene and replacing partial rosin with the polyisobutene or polybutylene, on the one hand, the consumption of the rosin can be reduced so that yellow rosin residuals are reduced, on the other hand, the polyisobutene or polybutylene residuals are both colorless and transparent viscous fluid and can soften the harder rosin residuals so that soldering paste residuals are soft, colorless and transparent substances, therefore, the probe test passing rate is greatly improved, and an effective guarantee is provided for the welding quality of electronic products.

Description

Technical field [0001] The invention involves welded technology, especially a welding paste and its welding agent and their manufacturing methods. Background technique [0002] Welding paste is widely used in high -precision electronic components. The use of welded paste can be used to isolate the air from oxidation.To a big role. [0003] At present, with the rapid development of science and technology, people's requirements for the welding quality of electronic products are getting higher and higher. Therefore, more and more electronic products use probe to test their welding performance after welding.But the existing patented welded paste has the following defects: [0004] After use, there is a lot of rosin residues on the welded joints, and the residues are harder. The probe cannot pierce the residue to touch the solder joints, so that the probe test is difficult or even pass. The quality of the welding operation cannot be obtained.Effective guarantee.In response to this iss...

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a solder paste and its flux and their manufacturing method, which can effectively solve the problem that the existing solder paste is difficult or even impossible to pass the probe test. question

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