Device packaging structure and packaging method thereof

Abstract

The invention discloses a device packaging structure which has a large effective heat dissipation area and does not generate environmental pollution and consumes less materials. Besides, the invention also discloses a packaging method corresponding to the device packaging structure. According to the invention, the packaging structure comprises a package body, a wafer packaged in the package body, and a pair of leads connected with the wafer and extending out of the package body, the package body is of a cylindrical structure, the leads are led out from the two bottoms of the cylindrical structure respectively; the device packaging structure also comprises a metal shell respectively and correspondingly arranged at two ends of the package body, the connection area is large, the metal shell is electrically connected with the lead at the corresponding end, and is electrically insulated from the metal shell and the lead which are arranged at the opposite side. Based on the structure, the repair and welding of a pin is not necessary when in use, material consumption is small and additional pollution cannot be generated.

Description

Technical field [0001] The invention relates to a device packaging structure, which belongs to the packaging structure of electronic devices used in circuit boards; at the same time, the invention also provides a packaging method of the device packaging structure. Background technique [0002] In the development process of electronic devices, many packaging forms have been produced in response to different technological levels and different objective needs in different periods. At present, electronic devices can be divided into plug-in and surface-mount categories in terms of packaging, but the common feature is that they are connected to the circuit board through leads, pass current through the leads, and use the metal material characteristics of the leads to enhance part of the heat dissipation capacity. The increase in heat dissipation capacity depends on the thermal conductivity of the lead material, the heat capacity of the lead body and the heat dissipation area of ​​the le...

AI Technical Summary

Problems solved by technology

[0011] Therefore, in order to overcome the structural characteristics of the current device packaging structure that make related devices have poor heat dissipation performance during use, pollute the environment, and consume a lot of materials, the present invention provides a device that can effectively dissipate heat with a large area and will not pollute the environment during use. and a device packaging structure that consumes less material. At the same time, in response to the device packaging structure, the present invention also provides a packaging method

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