Electronic device and chassis thereof

A technology of electronic devices and chassis, which is applied in the direction of electrical digital data processing, digital processing power distribution, instruments, etc., and can solve problems such as difficult heat dissipation, large volume of electronic devices, and effective use of space occupied by the chassis.

Inactive Publication Date: 2011-10-05
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned electronic device needs to be separately provided with a wind guide cover, and the wind guide cover occupies the effective space of the chassis, making the

Method used

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  • Electronic device and chassis thereof
  • Electronic device and chassis thereof
  • Electronic device and chassis thereof

Examples

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Example Embodiment

[0016] The electronic device and its chassis of the present invention will be further described in detail below with reference to the drawings and embodiments.

[0017] See figure 1 and figure 2 The electronic device 100 in the first embodiment of the present invention includes a chassis 10, a motherboard 20, an electronic component 30, a first heat dissipation element 40, a second heat dissipation element 50, and a heat dissipation fan 60. The motherboard 20 is fixed in the chassis 10. The electronic component 30 is fixed on the main board 20 and is electrically connected to the main board 20. The first heat dissipating element 40 and the second heat dissipating element 50 are respectively fixed on the motherboard 20 to facilitate heat dissipation of the electronic components of the motherboard 20. The cooling fan 60 is fixed on the inner side wall of the case 10. The electronic device 100 may be a personal desktop computer, a server, etc. In this embodiment, a personal deskt...

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PUM

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Abstract

The invention relates to an electronic device. The device comprises a chassis, a heat dissipating element, a first air guiding element and a second air guiding element, wherein the heat dissipating element is arranged in the chassis; the first air guiding element and the second air guiding element are fixedly arranged on the inside wall of the chassis; the first air guiding element and the second air guiding element are arranged at an interval so that an air guiding channel is formed; an air inlet and an air outlet are arranged on the chassis at both ends of the air guiding channel; and the heat dissipating element is arranged in the air guiding channel. According to the electronic device, the first air guiding element and the second air guiding are fixedly arranged on the chassis to form the air guiding channel so as to dissipate the heat of the heat dissipating element, thereby the heat dissipation performance of the electronic device is improved; meanwhile, without the need of separately providing an air guiding cover, the effective utilization space of the chassis is increased so that the volume of the electronic device is smaller.

Description

Technical field [0001] The invention relates to an electronic device and its chassis. Background technique [0002] Electronic devices, such as personal desktop computers, servers, etc., usually contain their components in a chassis, so that the components can be dust-proof and electromagnetic interference-proof. [0003] An electronic device includes a chassis, a main board, electronic components, a fan, and an air duct. The motherboard is fixed in the chassis. The electronic component is fixed on the main board and electrically connected with the main board. The wind deflector is fixed above the electronic component, and it includes a top cover and two side covers arranged on two opposite sides of the top cover. The side cover and the two side covers form an air inlet and an air outlet. The fan is fixed to the air inlet of the air duct. The cold air blown by the fan enters from the air inlet of the air duct, absorbs the heat of the electronic components, and flows out from t...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20H05K7/20
Inventor 谭子佳张耀廷官志彬
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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