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Angle-adjustable heat dissipation stand

A heat dissipation frame, adjustable technology, applied in the field of heat dissipation frame, can solve the problems that the heat cannot be discharged in time, it is unfavorable for users to operate and use the computer, and the angle of the computer cannot be adjusted.

Inactive Publication Date: 2011-10-05
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

3C products are developing in the direction of increasing computing speed and large storage capacity, and at the same time are developing in the direction of small size, which leads to the fact that when the electronic components in 3C products operate at high speed, the heat generated cannot be discharged in time
Traditional heat dissipation equipment cannot adjust the angle of the computer placed on it, which is not conducive to the user's operation and use of the computer

Method used

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  • Angle-adjustable heat dissipation stand
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  • Angle-adjustable heat dissipation stand

Examples

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Embodiment Construction

[0053] see Figure 1 to Figure 3 , is a view of an angle-adjustable cooling rack 100 according to a preferred embodiment of the present invention. The heat sink 100 includes a base 10 , a heat sink 20 and a telescopic device 30 connecting the heat sink 20 to the base 10 . One end of the base 10 is rotatably connected to the cooling plate 20 , and the other end is connected to the telescopic device 30 . Electronic equipment, such as notebook computers, netbooks, etc., can be placed on the heat dissipation plate 20 to facilitate its use and promote its heat dissipation. The advantage of the present invention is that the use angle of the electronic equipment placed on the cooling plate 20 can be adjusted by adjusting the length of the telescopic device 30 .

[0054] The base 10 includes a V-shaped base plate 11 , two first fixing plates 12 protrude from the corners of the V-shape of the base plate 11 , and two second fixing plates 13 protrude from both ends of the V-shape of th...

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Abstract

The invention relates to an angle-adjustable heat dissipation stand, which is arranged below an electronic apparatus for dissipating heat from the bottom. The heat dissipation stand comprises a base, a heat dissipation plate and a telescopic device connecting the base and the heat dissipation plate, wherein the heat dissipation plate is arranged on the base in a rotary manner; the telescopic device includes a support frame, a location rod and a location assembly fixed on the location rod; the relatively distal ends of the support frame and the location rod are respectively fixed on the base and the heat dissipation plate in a rotary manner; the support frame includes a first bump column and a second bump column separated from each other; the first bump column and the second bump column respectively include a plurality of parallel bumps; and the location rod can move upwards or downwards or can be kept still relative to the support frame when the location assembly is transferred transversely between the first bump column and the second bump column separated from each other.

Description

technical field [0001] The invention relates to a cooling rack, in particular to an angle-adjustable cooling rack. Background technique [0002] With the development of technology, various 3C products (notebook computers, netbooks, PDAs, etc.) are becoming more and more popular. 3C products are developing in the direction of increased computing processing speed and large storage capacity, and at the same time are developing in the direction of small size, which leads to the fact that when the electronic components in 3C products operate at high speed, the heat generated cannot be discharged in time. [0003] Taking a notebook computer as an example, its heat dissipation vents are generally arranged at the bottom of the computer, but the bottom of the computer is usually in contact with objects, and the air circulation is slow. In order to enhance the air circulation at the bottom of the computer, such as cooling stand and cooling pad have appeared on the market. Traditiona...

Claims

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Application Information

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IPC IPC(8): G06F1/20F16M11/04F16M11/18
Inventor 陈松亚
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD