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Wafer end surface cleaning method

A wafer and end face technology, which is applied in the field of cleaning the end face of semiconductor wafers, can solve the problems of increasing wafer manufacturing costs and large consumption

Inactive Publication Date: 2011-10-12
叶伟清
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process consumes a lot of chemicals and pure water, increases the cost of wafer manufacturing, and challenges the requirements of energy saving and emission reduction

Method used

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Experimental program
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Effect test

Embodiment Construction

[0009] The present invention adopts the following specific methods to clean the semiconductor wafer end face:

[0010] Select the semiconductor wafer to be operated;

[0011] Use the manipulator to place the wafer on the lifter that can move freely in the up and down direction; the lifter descends, and the wafer is placed on the disc that supports the wafer freely; the concentric adjustment mechanism aligns the center of the wafer with the center of the disc; The circle rotates and drives the three wheels fixed on the lower side of the disc to rotate together; the concentric adjustment mechanism keeps the wafer horizontal and rotates concentrically;

[0012] The wafer end face 5 is cleaned by a cleaning jig 1; the structure of the cleaning jig has a slit 2 on the side, and a liquid output pipeline 3 and a liquid recovery pipeline 4 inside, wherein the liquid output pipeline is used to output cleaning liquid or pure The water and liquid recovery pipes are used to recover the w...

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PUM

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Abstract

The invention discloses an end surface cleaning method of a semiconductor wafer. Compared with the soak cleaning method, the method does not need a large amount of chemical agent to immerse the whole wafer to get rid of the pollutant, instead creatively provides that the medicament droplets, by the surface tension, adhered in a cleaning clamp slit are used to clean the wafer end surface. Each cleaning process only needs microliter of cleaning fluid, which greatly reduces the dosage of the cleaning liquid, and reduces the cleaning cost and the discharge amount of the waste liquid in the cleaning process.

Description

technical field [0001] The invention relates to a method for cleaning a semiconductor wafer, in particular to a method for cleaning the end face of a semiconductor wafer. Background technique [0002] With the advancement of integrated circuit manufacturing technology, the cleanliness of the wafer surface in wafer processing is getting higher and higher, and a small amount of pollutants may cause the quality of expensive wafers to decline or even be scrapped. There are many sources of contamination in the wafer manufacturing process, and it is easy to contaminate the wafer end face. For the end face contaminated during the wafer manufacturing process, the traditional treatment method is to immerse the entire wafer in chemicals or pure water for cleaning. This process consumes a lot of chemicals and pure water, which increases the cost of wafer manufacturing and challenges the requirements of energy saving and emission reduction. If the polluted end face can be cleaned in a...

Claims

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Application Information

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IPC IPC(8): H01L21/00B08B3/00B08B3/08
Inventor 叶伟清
Owner 叶伟清