Film and adhesive/bonding sheet

A technology of adhesive sheets and films, which is applied in the direction of adhesives, thin material processing, synthetic resin layered products, etc., and can solve problems such as difficulty in recycling, deformation, and reattachment of adhesive sheets to adherends, etc.

Inactive Publication Date: 2011-10-19
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reason is that, in order to recycle the strip deformed into a cylindrical shape in a practically useful way, in addition to the recovery using the stripping tape, it is also considered to grab it with a mechanical arm or blow it off with the wind (Japanese Patent Application 2009- 200231), but in all methods, the cylindrical shape is likely to be deformed due to the stress in these recycling operations, and the adhesive sheet is reattached to the adherend, etc., so that recycling may become difficult

Method used

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  • Film and adhesive/bonding sheet
  • Film and adhesive/bonding sheet
  • Film and adhesive/bonding sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] As shown in Table 1, Spaceclean S7200 (thickness: 30 μm) manufactured by Toyobo Co., Ltd. (the product of Young’s modulus and thickness is 102000 N / m) was used as the heat-shrinkable base material. As the alcohol-based adhesive, Lumirror S105 (38 μm in thickness) manufactured by TORAY INDUSTRIES, INC., which is a non-heat-shrinkable base material, was laminated on the heat-shrinkable base material to obtain a film.

Embodiment 2

[0106] A film was obtained in the same manner as in Example 1, except that the non-heat-shrinkable substrate was Lumirror E10 (thickness: 12 μm) manufactured by TORAY INDUSTRIES, INC.

Embodiment 3

[0108] A film was obtained in the same manner as in Example 1 except that the adhesive resin layer was formed of an acrylic adhesive.

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Abstract

The invention provides a film and an adhesive / bonding sheet. When the film that is fixed to a surface of an adherend by means such as adhesion and rolled into a cylinder by heating is grasped by a grasping tool or adhered to a holder in order to remove the film from the surface of the adherend, the grasping tool or holder applies a force to the rolled film to urge the film toward the surface of the adherend. If the rolled film is pressed flat by the force, the area of contact between the film and the adherend increases and so does the strength of adhesion between them. Consequently, the film needs to be re-grasped or reattached to the holder or a larger force is required in order to peel the rolled film off the adherend. To solve the problem, there is provided a film that includes a thermally shrinkable base material, an adhesive resin layer and a non-thermally shrinkable base material stacked in sequence and has the property of rolling up into a cylindrical roll by heating and not automatically returning to the original shape after the change into the cylindrical roll.

Description

technical field [0001] The present invention relates to a film that deforms into a cylindrical shape by heating and maintains the deformed shape, and an adhesive sheet using the film. Background technique [0002] The inventors of the present invention have so far developed an easily peelable pressure-sensitive adhesive sheet based on a laminate of heat-shrinkable film layer / adhesive resin layer (adhesive adhesive layer) / rigid resin film layer (Japan Patent May No. 2009-041200 and Patent Document 1). [0003] This tape is characterized in that shrinkage stress generated by heating the substrate can be converted into torque on the laminate, and the PSA sheet can be peeled from the adherend as if peeling by hand (peel peeling). In addition, the tape shape after peeling was cylindrical. [0004] In order for the tape to be useful for practical use, it is necessary to easily recover the cylindrical object, and more specifically, it is necessary to maintain the cylindrical stat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00B32B7/028
CPCB29C53/32B29C61/02B29K2995/0049B29L2009/00B32B1/00B32B7/12B32B27/08B32B37/12B32B37/144B32B2307/736C09J2467/006H01L21/6836H01L2221/6834H01L2221/68381H01L2221/68386B32B5/18B32B25/08B32B27/065B32B27/302B32B27/304B32B27/32B32B27/34B32B27/36B32B27/40B32B2266/0242B32B2266/0278B32B2307/308B32B2307/536B32B2307/54B32B2307/542B32B2307/732B32B2307/734Y10T428/2848Y10T428/31786Y10T428/31544Y10T428/31725Y10T428/31935Y10T428/31721Y10T428/31855C09J2301/162B32B7/028B32B37/00
Inventor 西尾昭德
Owner NITTO DENKO CORP
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