Wafer detecting system

Abstract

The invention relates to a wafer detecting system, which comprises wafer processing equipment, wafer conveying equipment and a protection circuit. The wafer processing equipment comprises a first control desk, a first manipulator and a wafer loading platform; the first control desk is suitable for controlling the first manipulator, and is suitable for outputting a loading signal and an unloading signal; the wafer conveying equipment comprises a second control desk and a second manipulator; the second control desk receives the loading signal output by the first control desk, and controls the second manipulator to load a wafer on the wafer loading platform; and the protection circuit is suitable for detecting a position of the first manipulator of the wafer processing equipment, and transmitting the unloading signal to the second control desk when the first manipulator is located at a preset safe region. Thus, the damage to the first manipulator, the second manipulator or the wafer caused by collision among the first manipulator, the second manipulator and the wafer can be effectively avoided.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a wafer detection system. Background technique [0002] In the semiconductor manufacturing process, it is usually necessary to combine wafer transfer equipment and wafer processing equipment (such as wafer inspection equipment, etching equipment, cleaning equipment, etc.) Operations such as cleaning and testing. The wafer processing equipment mainly includes a first console, a first manipulator and a wafer carrier; the wafer transfer equipment mainly includes a second console and a second manipulator. The operator can control the consoles of each device in the system, and control the second manipulator in the wafer transfer device to load the wafer onto the wafer carrier of the wafer processing device, and then the first manipulator of the wafer processing device moves from the Grab the wafer on the wafer stage for etching, cleaning and testing operations. After the opera...

AI Technical Summary

Problems solved by technology

Therefore, if the first manipulator 102 picks up the wafer from the wafer stage 103 or puts the wafer back into the wafer stage 103, the second manipulator 202 according to the received unloading signal When the wafer is unloaded, it is easy to cause the first manipulator 102, the second manipulator 202 and the wafer to collide with each other, thereby causing damage to the first manipulator 102, the second manipulator 202 and the wafer

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