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Wiring board and method for manufacturing same

A manufacturing method and wiring board technology, applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit, etc., can solve the problems of high manufacturing cost and large material consumption, and achieve the effect of reducing manufacturing cost and reducing material consumption

Inactive Publication Date: 2013-07-31
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] It is considered that in the wiring boards and their manufacturing methods described in Patent Documents 1 to 4, the manufacturing cost is high due to large material consumption and the like.

Method used

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  • Wiring board and method for manufacturing same
  • Wiring board and method for manufacturing same
  • Wiring board and method for manufacturing same

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Embodiment Construction

[0038] Hereinafter, one embodiment that actualizes the present invention will be described in detail with reference to the drawings.

[0039] In the wiring board 10 of this embodiment, for example Figure 1A , Figure 1B 1 and 2 respectively show its appearance and its internal structure, and it has wiring boards 12a, 12b, 12c, 12d, 12e, 12f and an insulating board 11 as a frame part. The insulating substrate 11, the wiring substrates 12a to 12f, and the other wiring substrates 12a to 12f are arranged horizontally with boundary portions R1 and R2 interposed therebetween, respectively. Further, a sixth insulating layer 313 and a fifth insulating layer 311 are formed on the front and back surfaces of the insulating substrate 11 and the wiring substrates 12a to 12f, respectively. in addition, Figure 1B It is a diagram showing the internal structure of the wiring board 10 with the fifth insulating layer 311 and the sixth insulating layer 313 removed.

[0040] The insulating su...

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PUM

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Abstract

A wiring board (10) includes an insulating substrate (11), wiring substrates (12a, 12b) having wiring layers (124, 125), and insulating layers (311, 313). The insulating layer (311, 313) has a via hole (331, 333), and a conductor (341, 343) formed by plating is formed in the via hole. The insulating substrate (11) and the wiring substrates (12a, 12b) are arranged horizontally. The insulating layer (311, 313) is disposed so as to cover the boundary portion (R1) between the insulating substrate (11) and the wiring substrate (12a, 12b), and extends continuously from the insulating substrate (11). Installed on the wiring board (12a, 12b). The resin (21a-21c) constituting the insulating layer (311, 313) is filled in the boundary part (R1). The conductors (341, 343) and the wiring layers (124, 125) are electrically connected to each other.

Description

technical field [0001] The present invention relates to a wiring board having an insulating substrate and a plurality of wiring substrates and a manufacturing method thereof. Background technique [0002] For example, Patent Documents 1 to 4 disclose a wiring board and a manufacturing method thereof. The wiring board includes an insulating substrate and a plurality of wiring substrates connected to the insulating substrate. [0003] Patent Document 1: Japanese Patent Application Publication No. 2002-289986 [0004] Patent Document 2: Japanese Patent Application Publication No. 2002-232089 [0005] Patent Document 3: Japanese Patent Application Publication No. 2007-115855 [0006] Patent Document 4: Japanese Patent Application Publication No. 2005-322878 [0007] It is considered that in the wiring boards and their manufacturing methods described in Patent Documents 1 to 4, the manufacturing cost is high due to large material consumption and the like. Contents of the in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/14
CPCH05K1/142H05K3/4602H05K3/4694H05K2201/0187H05K2201/2018Y10T29/49124Y10T29/49155H05K1/14H05K3/46H05K1/115H05K3/10
Inventor 高桥通昌
Owner IBIDEN CO LTD