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Fluorescent-powder-free single-chip GaN (gallium nitride)-based LED (light-emitting diode) and manufacturing method thereof

A light-emitting diode and phosphor-free technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low luminous efficiency and poor color rendering, and achieve good color rendering, easy preparation, and improved service life.

Inactive Publication Date: 2011-11-02
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the defects of poor color rendering and low luminous efficiency of existing GaN-based light-emit

Method used

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  • Fluorescent-powder-free single-chip GaN (gallium nitride)-based LED (light-emitting diode) and manufacturing method thereof
  • Fluorescent-powder-free single-chip GaN (gallium nitride)-based LED (light-emitting diode) and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] White light-emitting diodes with blue light quantum wells, green light quantum wells and red light quantum dots in the epitaxial active region on the sapphire substrate by MOCVD, such as figure 1 , the specific epitaxial growth steps are:

[0039] 1. Put the sapphire substrate prepared for epitaxy into the MOCVD reaction chamber, first degas the sapphire substrate with hydrogen at high temperature, the temperature is 1060°C, and the pressure is 200mbar.

[0040] 2. According to the traditional two-step growth method (“GaN Growth Using GaN Buffer Layer” JAPANESE JOURNAL OF APPLIED PHYSICS PART2-LETTERS Volume 30: 1705-1707), a 30nm GaN buffer layer was epitaxially grown on the sapphire surface.

[0041] 3. Grow n-type GaN on the GaN buffer layer under the conditions of 1050°C and 400mbar, and the dopant is SiH 4 , with a growth thickness of about 4 μm and an electron concentration of 5×10 18 cm -3 .

[0042]4. Epitaxial growth of 5 blue light quantum wells on the n-t...

Embodiment 2

[0050] White light-emitting diodes with blue light quantum wells, green light quantum dots and red light quantum dots in the epitaxial active area on the sapphire substrate by MOCVD, such as figure 2 , the specific epitaxial growth steps are:

[0051] 1. Put the sapphire substrate prepared for epitaxy into the MOCVD reaction chamber. First, the sapphire substrate is degassed with hydrogen at a high temperature at a temperature of 1050° C. and a pressure of 500 mbar.

[0052] 2. According to the two-step growth method described in Embodiment 1, a 20 nm GaN buffer layer is epitaxially grown on the sapphire surface.

[0053] 3. Grow n-type GaN on the GaN buffer layer under the conditions of 1050°C and 400mbar, and the dopant is SiH 4 , with a growth thickness of about 4 μm and an electron concentration of 5×10 18 cm -3 .

[0054] 4. On the n-type GaN bulk material, five unintentionally doped blue light quantum wells are epitaxially grown. The quantum well structure is: the ...

Embodiment 3

[0062] White light-emitting diodes with blue light quantum wells, green light quantum wells and red light quantum dots in the epitaxial active area on SiC substrates by MOCVD, such as figure 1 , the specific epitaxial growth steps are:

[0063] 1. Put the SiC substrate prepared for epitaxy in the MOCVD reaction chamber, first degas the SiC substrate with hydrogen at high temperature, the temperature is 1150°C, and the pressure is 200mbar.

[0064] 2. According to the traditional two-step growth method, a 50nm AlN buffer layer is epitaxially grown on the surface of the SiC substrate.

[0065] 3. Grow n-type GaN on the AlN buffer layer under the conditions of 1050°C and 400mbar, and the dopant is SiH 4 , the growth thickness is about 150nm, and the electron concentration is 5×10 17 cm -3 .

[0066] 4. Epitaxial growth of 7 blue light quantum wells on the n-type GaN bulk material, the quantum well structure is: InGaN with a well of 5nm (In composition 27%), and GaN with a bar...

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Abstract

The invention relates to a fluorescent-powder-free single-chip GaN (gallium nitride)-based LED (light-emitting diode). The LED comprises a substrate material, a buffer layer, an n-type GaN material, an active area, a p-type AlGaN barrier layer and a p-type GaN contact layer, wherein the buffer layer, the n-type GaN material, the active area, the p-type AlGaN barrier layer and the p-type GaN contact layer grow in an epitaxial way on the substrate material in sequence; and the active area comprises a blue-light quantum well, a green-light quantum well or a quantum point layer and a red-light quantum point layer. The invention also relates to a manufacturing method of the fluorescent powder-free single-chip GaN-based LED of the single chip. The LED has the advantages of high efficiency, good color rendering property, stable color temperature and low cost, and has wide application prospects in general illumination field and other special illumination fields.

Description

technical field [0001] The invention relates to the field of semiconductor materials, in particular to a phosphor-free single-chip GaN-based light-emitting diode and a preparation method thereof. Background technique [0002] Group III nitride semiconductor materials represented by GaN have excellent photoelectric properties and stable physical and chemical properties. At present, light-emitting diodes made of GaN materials have been widely used in white light semiconductor lighting. GaN-based light-emitting diodes have the advantages of high efficiency and long life when used in white light lighting. At present, there are three main ways to realize GaN-based LED white light lighting: [0003] 1. Using GaN-based blue light-emitting diodes to excite yellow phosphors to emit white light; [0004] 2. Using GaN-based red, blue and green three primary color light-emitting diodes to mix and emit white light; [0005] 3. Using GaN-based ultraviolet light-emitting diodes to excit...

Claims

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Application Information

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IPC IPC(8): H01L33/06H01L33/32H01L33/00
Inventor 罗毅王嘉星汪莱郝智彪
Owner TSINGHUA UNIV