Autobias photoelectrochemical cell based on p-type silicon photocathode, and preparation method thereof
A photoelectrochemical cell and p-type silicon technology, applied in photosensitive equipment, electrolytic capacitors, circuits, etc., can solve the problems of low light conversion efficiency and the need for noble metal catalysts, and achieve good application prospects, low-temperature preparation, and cost savings. Effect
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Embodiment 1
[0029] A p(111) monocrystalline silicon wafer with a side length of 2 cm was selected, and firstly ultrasonically cleaned with acetone and absolute ethanol for 10 minutes respectively. Then put in a mixed solution of sulfuric acid and hydrogen peroxide with a volume ratio of 3:1 to clean for 10 minutes, then soak in diluted hydrofluoric acid for 3 minutes, and then quickly move into hydrofluoric acid (concentration: 5.0M) and silver nitrate ( Concentration of 0.02M) in the mixed solution for hydrothermal reaction, standing reaction at 5 ° C for 20 minutes. After cooling and taking out, rinse off the loose attachments on the surface with a large amount of deionized water, then immerse in concentrated nitric acid for 2 hours to remove impurity silver, and finally blow dry. On the back of silicon substrate 1 where p-type silicon nanowire array 2 is grown, aluminum film and gold film are successively sputtered to make ohmic electrodes, leaving 0.25cm on the front. 2 The rest of t...
Embodiment 2
[0032] A p(100) monocrystalline silicon wafer with a side length of 2 cm was selected, and firstly ultrasonically cleaned with acetone and absolute ethanol for 10 minutes respectively. Then put in a mixed solution of sulfuric acid and hydrogen peroxide with a volume ratio of 3:1 to wash for 10 minutes, then soak in diluted hydrofluoric acid for 3 minutes, and then quickly move into hydrofluoric acid with a concentration of 5.0M and a concentration of 0.02M. The hydrothermal reaction was carried out in a mixed solution of silver nitrate, and the reaction was left to stand at 50° C. for 50 minutes. After cooling and taking out, rinse off the loose attachments on the surface with a large amount of deionized water, then immerse in concentrated nitric acid for 2 hours to remove impurity silver, and finally blow dry. On the back of silicon substrate 1 where p-type silicon nanowire array 2 is grown, aluminum film and gold film are successively sputtered to make ohmic electrodes, leav...
Embodiment 3
[0035] A p(111) monocrystalline silicon wafer with a side length of 2 cm was selected, and firstly ultrasonically cleaned with acetone and absolute ethanol for 10 minutes respectively. Then put in a mixed solution of sulfuric acid and hydrogen peroxide with a volume ratio of 3:1 to wash for 10 minutes, then soak in diluted hydrofluoric acid for 3 minutes, and then quickly move into hydrofluoric acid with a concentration of 5.0M and a concentration of 0.02M. The hydrothermal reaction was carried out in a mixed solution of silver nitrate, and the reaction was left to stand at 50° C. for 60 minutes. After cooling and taking out, rinse off the loose attachments on the surface with a large amount of deionized water, then immerse in concentrated nitric acid for 2 hours to remove impurity silver, and finally blow dry. On the back of silicon substrate 1 where p-type silicon nanowire array 2 is grown, aluminum film and gold film are successively sputtered to make ohmic electrodes, leav...
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