Ga-Te-based thermoelectric semiconductor with superstructure and preparation method thereof
A thermoelectric semiconductor and superstructure technology, applied in chemical instruments and methods, thermoelectric device junction lead wire materials, self-solids, etc., to achieve the effect of simple process and low cost
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Embodiment 1
[0027] Replace Ga with Sb element with a mole fraction of 0.1 2 Te 3 Ga element in. First according to the chemical formula Ga 1.9 Sb 0.1 Te 3 Weigh the Ga, Sb, and Te elements with a purity greater than 99.999wt.% and place them in a vacuum quartz tube. The smelting synthesis temperature is 1000-1100° C., and the smelting synthesis time is 24 hours. Shake the tube every 1 hour during the melt to ensure a uniform reaction. After smelting and synthesis, it is cooled to room temperature with the furnace. The ingot is pulverized and ball milled, and the ball milling time is controlled at 5 hours, and the powder after ball milling is formed by discharge plasma spark sintering (SPS). The sintering temperature is 350-550°C, and the sintering pressure is 30-50MPa.
Embodiment 2
[0029] Replace Ga with Sb and Cu with mole fractions of 0.1 and 0.05, respectively 2 Te 3 Ga and Te two elements in. First according to the chemical formula Ga 1.9 Sb 0.1 Cu 0.05 Te 2.95 Ga, Cu, Sb, and Te four elements with a purity greater than 99.999wt.% were weighed and placed in a vacuum quartz tube. The smelting synthesis temperature is 1000-1100° C., and the smelting synthesis time is 24 hours. Shake the tube every 1 hour during the melt to ensure a uniform reaction. After smelting and synthesis, it is slowly cooled in the furnace to 700-900°C, and then quenched in water. The quenched ingot is pulverized and ball milled, and the ball milling time is controlled at 5 hours, and the ball milled powder is formed by discharge plasma spark sintering (SPS). The sintering temperature is 350-550°C, and the sintering pressure is 40-60MPa. The sintered bulk material is annealed in a vacuum environment for 100-400 hours, and the annealing temperature is 300-500°C.
Embodiment 3
[0031] Replace Ga with Sb and Cu with mole fractions of 0.1 and 0.05, respectively 2 Te 3 Ga and Te two elements in. First according to the chemical formula Ga 1.9 Sb 0.1 Cu 0.05 Te 2.95 Ga, Cu, Sb, and Te four elements with a purity greater than 99.999wt.% were weighed and placed in a vacuum quartz tube. The smelting synthesis temperature is 1000-1100° C., and the smelting synthesis time is 24 hours. Shake the tube every 1 hour during the melt to ensure a uniform reaction. After smelting and synthesis, it is slowly cooled in the furnace to 700-900°C, and then quenched in water. The quenched ingot is pulverized and ball milled, and the ball milling time is controlled at 5 hours, and the ball milled powder is formed by discharge plasma spark sintering (SPS). The sintering temperature is 350-550°C, and the sintering pressure is 40-60MPa. The sintered bulk material is annealed in a vacuum environment for 500-900 hours, and the annealing temperature is 300-500°C.
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Abstract
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