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LED microarray packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of cumbersome process, small level, and inability to achieve

Inactive Publication Date: 2011-11-09
江门思玛特光电科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

However, the multi-chip LEDs in the prior art are individually packaged for each LED chip, and the process is relatively cumbersome, and because the SMT process is used, the minimum processing size can only be 100um, and cannot be smaller. grade

Method used

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  • LED microarray packaging structure and manufacturing method thereof
  • LED microarray packaging structure and manufacturing method thereof
  • LED microarray packaging structure and manufacturing method thereof

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Embodiment Construction

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0034] see figure 1 and Figure 11 One embodiment of the present invention provides an LED microarray packaging structure 100, which includes a substrate 12, a plurality of spaced first electrodes 122 disposed on the substrate 12, a plurality of LED chips 14 arranged in an array, and a plurality of second electrodes .

[0035] The substrate 12 is square in this embodiment, and its material can be copper or other suitable metals or metal alloys, such as aluminum or aluminum alloy, or other suitable non-metals, such as silicon and ceramics. The first electrodes 122 are disposed on the substrate 12 and insulated from the substrate 12 , and the first electrodes 122 are arranged at intervals corresponding to each row of the LED chip array 14 .

[0036] The LED chip 14 is a blue gallium nitride (GaN) LED chip in this embodiment. Of course, the L...

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Abstract

The invention provides an LED (Light Emitting Diode) microarray packaging structure and a manufacturing method thereof. The LED microarray packaging structure comprises a substrate and a plurality of LED chips distributed on the substrate in the form of an array, wherein each chip comprises a first surface adjacent to the substrate; a first electrode is included between each LED chip and the substrate so that the first surfaces between rows or lines of the LED chips are electrically connected with each other; and second surfaces of the LED chips far away from the substrate comprise second electrodes so that the second surfaces between lines or rows of the LED chips are electrically connected with each other. In addition, the invention also relates to a method for manufacturing the LED microarray packaging structure.

Description

technical field [0001] The invention relates to an LED microarray packaging structure and a method for manufacturing the LED microarray packaging structure. Background technique [0002] Currently, light emitting diodes (Light Emitting Diodes, LEDs) are gradually replacing Cold Cathode Fluorescent Lamps (CCFLs) as light emitting elements in lighting devices due to their good light quality and high luminous efficiency. [0003] Existing LEDs are usually made by placing the LED chip on a substrate, such as a metal plate, after making the LED chip, and then going through subsequent processes, such as encapsulating a lens. However, the multi-chip LEDs in the prior art are individually packaged for each LED chip, and the process is relatively cumbersome, and because the SMT process is used, the minimum processing size can only be 100um, and cannot be smaller. grade. [0004] In view of this, it is necessary to provide an LED microarray packaging structure. Contents of the inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L21/782H01L21/58H01L21/60
Inventor 赖志成
Owner 江门思玛特光电科技有限公司
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