Multilayer board
A multi-layer substrate and film layer technology, which is applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of reduced reliability of interlayer connections
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0028] The first embodiment will refer to Figure 1-5 to describe.
[0029] Such as figure 1 As shown, the multilayer substrate 1 comprises electronic components 2, such as eg chips made of semiconductors. The multilayer substrate 1 is produced by heat-pressing a plurality of resin films.
[0030] The multilayer substrate 1 is mainly composed of a thermoplastic resin film layer 10 , a first pattern layer 20 , a second pattern layer 30 and a heat sink 3 .
[0031] The thermoplastic resin film layer 10 is made of a plurality of thermoplastic resin films laminated on each other as an insulating base material. The thermoplastic resin film layer 10 includes, for example, three layers of thermoplastic resin films in this embodiment.
[0032] Specifically, the thermoplastic resin film layer 10 includes a first adhesive layer 12 , a second adhesive layer 13 and an intermediate layer 11 positioned between the adhesive layers 12 , 13 . Adhesive layer 12 consists of Figure 2A The ...
no. 2 example
[0081] will refer to Figure 6-8 A second embodiment is described.
[0082] In the case where the connectors 11a, 12b, 13b are constructed of paste 113, 124, 134, when the thickness of the adhesive layer 12 is smaller than the thickness of the adhesive layer 13, the interlayer connections in the connector 13b are less effective than those in the connector 12b. Reduced reliability.
[0083] In general, if the ratio of the thickness of the layer having the via hole to the diameter of the via hole has a value within a predetermined range, the paste is properly filled in the via hole. The diameter of the via hole is formed to increase as the thickness of the layer increases. Therefore, the amount of paste filled in the via holes increases as the thickness of the layer increases.
[0084] The solvent contained in the paste is volatilized when the metal particles are sintered. Therefore, voids are easily generated in the interlayer connector with more paste, so that the reliabil...
no. 3 example
[0102] The third embodiment will refer to Figure 9-11 describe.
[0103] Such as Figure 9 As shown, the conductive pattern 114 is arranged on the surface of the intermediate layer 11 opposite to the connector 13 b of the adhesive layer 13 , and the conductive pattern 115 is arranged on the surface of the intermediate layer 11 opposite to the second connector 12 b of the adhesive layer 12 .
[0104] Figure 10B The production process of the interlayer film 110 corresponding to the intermediate layer 11 of the thermoplastic resin film layer 10 will be described below. A thermoplastic resin film is prepared as an insulating base material. The electronic component 2 is accommodated in the accommodation hole 111 , and the paste 113 is filled in the through hole 112 .
[0105] Also, copper foil is laminated on each of the upper and lower surfaces of the intermediate layer 110, and etching is performed on the copper foil. Thus, the wire pattern 114 is defined at a position opp...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More