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Convex cup structure LED light source module packaging structure

An LED light source and packaging structure technology, applied in electrical components, electric solid state devices, circuits, etc., can solve the problems of increasing production costs, reducing production efficiency, lead damage, etc., saving production costs, improving production efficiency, and reducing lead wires. damage effect

Inactive Publication Date: 2015-12-16
莆田康布斯光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above-mentioned traditional LED light source module packaging structure, since the LED chip and the circuit board need to be connected by leads, but the LED chip is arranged inside the reflector, and the circuit board is arranged outside the reflector, so in the production process In the process, it is easy to cause the lead wire between the LED chip and the circuit board to be damaged due to artificial breakage, which greatly reduces the production efficiency, and the production process becomes more complicated and increases the production cost.

Method used

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  • Convex cup structure LED light source module packaging structure
  • Convex cup structure LED light source module packaging structure
  • Convex cup structure LED light source module packaging structure

Examples

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with specific embodiments.

[0018] see Figure 1 to Figure 4 As shown, it is a convex cup structure LED light source module packaging structure according to the present invention, including a base 11, an LED chip 12, an insulating glue 13, a mixed layer of glue and phosphor powder 14, a reflective cup 15, a circuit board 16, and a wire 17. The base 11 is evenly provided with eight reflective cups 15 arranged in a straight line. The base 11 in this embodiment is elongated, and the reflective cups 15 are circular. The base 11 is stamped by a metal material through a molding process. There is an electroplated reflective layer on its upper surface. In this embodiment, the reflective layer is a silver-plated layer. The bottom of the reflective cup 15 is provided with a number of LED chips 12. These LED chips 12 are glued to the surface of the reflective cup 15 by insulating glue At the bottom, the refl...

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PUM

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Abstract

The invention provides a package structure of an LED (light emitting diode) light source module of a convex cup structure, belonging to the manufacturing field of illumination devices. The package structure comprises base seats of a plurality of light reflection cups which are arrayed linearly; the bottom part of each light reflection cup is provided with at least one LED chip; the LED chip is glued to the bottom part of the light reflection cup through an insulation glue; the light reflection cup is surrounded by an annular protrusion; the side wall of the light reflection cup is also provided with two openings; each light reflection cup is connected through the openings; each base seat is also provided with a circuit board groove in a concave mode; two ends of the circuit board groove respectively extend to the light reflection cups at the head end part and the tail end part; each LED chip is connected to the circuit board through a lead wire; a mixture layer of glue and fluorescent powder is coated on the LED chips in the light reflection cups and the circuit boards extending into the openings of the light reflection cups.

Description

technical field [0001] The invention relates to a lighting device, in particular to a high-power LED light source module. Background technique [0002] LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various low-voltage lighting devices. The traditional LED light source module packaging structure generally includes a metal base with a reflector cup. There are several LED chips in the center of the bottom of the cup. The LED chips are evenly glued to the center of the bottom of the reflective cup by welding or insulating glue. The circuit board outside the cup, and then coat the upper surface of the LED chip with a mixed layer of glue and phosphor so that the LED chip is completely covered inside the mixed layer. In the above-mentioned traditional LED light source module packaging structure, since the LED chip and the circuit board need to be connected by leads, but the LED chip is arranged inside the reflector, and the ci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/60H01L33/62
Inventor 何文铭唐秋熙童庆锋申小飞
Owner 莆田康布斯光电科技有限公司
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