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Adhesive composition, circuit connection material, connection structure of circuit members, and semiconductor device

A technology of circuit connection materials and adhesives, which is applied in the direction of semiconductor devices, printed circuit manufacturing, and assembly of printed circuits with electrical components, can solve problems such as difficult storage stability, and achieve sufficient and stable bonding strength and connection resistance. Wide process time domain and the effect of expanding the process time domain

Inactive Publication Date: 2011-12-14
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to achieve this low-temperature rapid hardening, it is necessary to use a latent heat catalyst with active energy. However, it is difficult for a latent heat catalyst with low activity energy to have storage stability near room temperature at the same time.

Method used

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  • Adhesive composition, circuit connection material, connection structure of circuit members, and semiconductor device
  • Adhesive composition, circuit connection material, connection structure of circuit members, and semiconductor device
  • Adhesive composition, circuit connection material, connection structure of circuit members, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0172] In the above-mentioned 62.5 parts by mass of phenoxy resin solution (containing 25 parts by mass of phenoxy resin), mix 25 parts by mass of glycine resin in solid content, 25 parts by mass of M-215 as a radical polymerizable compound , 25 parts by mass of AT-600, 5 parts by mass of P-2M, 3 parts by mass of perhexyl O as a radical polymerization initiator, and 0.2 parts by mass of TEMPOL as a stable radical compound. The above-mentioned conductive particles were dispersed and mixed in the obtained solution to obtain an adhesive composition, and the mixing ratio of the conductive particles was 1.5% by volume relative to the total amount of the adhesive composition.

[0173] Next, the obtained adhesive composition was coated on a fluororesin film with a thickness of 80 μm using a coating device (manufactured by Yasui Seiki Co., Ltd., trade name: SNC-S3.0) to obtain a coating film, and then passed This coating film was dried with hot air at 70° C. for 10 minutes to obtain a...

Embodiment 2

[0175] Except mixing 0.2 parts by mass of TEMPOL-NHAc as a stable radical compound instead of 0.2 parts by mass of TEMPOL, the same procedure as in Example 1 was carried out to obtain a film-like circuit connecting material.

Embodiment 3

[0177] Except mixing 0.2 parts by mass of TEMPO as a stable radical compound instead of 0.2 parts by mass of TEMPOL, the same procedure as in Example 1 was carried out to obtain a film-like circuit connection material.

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Abstract

An adhesive composition which contains an adhesive component comprising a thermoplastic resin, a radical-polymerizable compound, and a radical polymerization initiator, wherein the adhesive component exhibits a signal in the ESR measurement at 25°C.

Description

[0001] The present invention is the application number 200680038502.7 (international application number is PCT / JP2006 / 316589), the application date is August 24, 2006, and the invention name is "adhesive composition, circuit connection material, connection structure of circuit components and semiconductor" Device" is a divisional application of the invention application. technical field [0002] The present invention relates to an adhesive composition, a circuit connection material, a connection structure of circuit members, and a semiconductor device. Background technique [0003] In semiconductor elements and liquid crystal display elements, in order to combine various components in the element, various adhesives have been used all the time. Thermal performance, reliability in high temperature and high humidity conditions, etc. [0004] Conventionally, as an adhesive used for semiconductor elements and liquid crystal display elements, thermosetting resins such as epoxy re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J9/02C09J7/00H01L23/00H05K3/32
CPCH01L2924/01006H01L2224/83101H01L2924/01049C09J4/00H01L24/32H01L2924/01004H01L2924/10329H01L2224/16H05K3/323H01L2924/01082H01L2924/01076H01L2924/01012H01L2924/01027H01L2924/01015H01L2924/01005H01L2924/01033H01L2924/01047H01L2924/01079H05K2203/1163H01L2924/01013H01L2924/10253H01L2224/32225H01L2924/014H01L2924/01078H01L2924/01045H01L2924/10336H01L2924/10349H01L2224/8388H01L2924/01023H01L2924/0105H01L2924/0781H01L2924/01032H01L2224/2919H01L2924/01068H01L24/83H01L2924/01029H01L2924/09701H01L2924/07811H01L2924/0665H01L2924/07802H01L2924/12044H01L2924/15788H01L2924/00C09J9/00
Inventor 白坂敏明加藤木茂树
Owner RESONAC CORPORATION