Adhesive composition, circuit connecting material, connection structure of circuit connenctors, and semiconductor devices

Abstract

An adhesive composition which contains an adhesive component comprising a thermoplastic resin, a radical-polymerizable compound, and a radical polymerization initiator, wherein the adhesive component exhibits a signal in the ESR measurement at 25 DEG C.

Description

Adhesive composition, circuit connection material, connection structure of circuit members, and semiconductor device technical field The present invention relates to an adhesive composition, a circuit connection material, a connection structure of circuit members, and a semiconductor device. Background technique In semiconductor elements and liquid crystal display elements, in order to combine various components in the element, various adhesives have been used all the time. Thermal performance, reliability in high temperature and high humidity conditions, etc. Conventionally, as an adhesive used for semiconductor elements and liquid crystal display elements, thermosetting resins such as epoxy resins ( For example, refer to Patent Document 1). The constituents of the above-mentioned adhesive generally use an epoxy resin, a hardener such as a phenolic resin reactive with the epoxy resin, and a latent heat catalyst that promotes the reaction between the epoxy resin and the...

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Problems solved by technology

In order to achieve this low-temperature rapid hardening, it is necessary to use a latent heat catalyst with active energy. However, it is difficult for a latent heat catalyst with low activity energy to have storage stability near room temperature at the same time.

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