Embedded package structure of LED light source

A technology of LED light source and packaging structure, applied in the direction of light source, electric light source, light source fixing, etc., can solve the problems of unstable current, many ghosts, and uncompact structure, so as to improve the heat dissipation efficiency, expand the heat dissipation area, and help processing effect

Inactive Publication Date: 2011-12-14
NINGBO YINZHOU LEIMAI SEMICON TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although super-high-power LEDs can be made with this method, the method of making super-high-power LEDs is multiple pieces, the base is connected to the lamp, the structure is not compact, the heat conduction and heat dissipation structure is unreasonable, and the high heat cann

Method used

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  • Embedded package structure of LED light source
  • Embedded package structure of LED light source
  • Embedded package structure of LED light source

Examples

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[0020] The present invention will be described in further detail below in conjunction with the embodiments of the drawings.

[0021] See Figure 1-3 , An embedded package structure of LED light source, including LED light source, bracket 2 and base 3. The LED light source is a long strip, including an optical lens 11 and an LED chip 12. The surface of the optical lens 11 is a sloped semi-circular arc convex shape, and the interior is concave 13. The insulating bottom of the LED chip 12 is at the operating point required by the light source packaging process Conductive and thermal conductive silver glue. The optical lens 11 is arranged above the LED chip 12 and adopts diffuse reflection and high light transmission optical glass. The lens body is extremely thin and has high light transmission performance. Different lenses can be selected according to the requirements of different occasions, which solves the problem of difficult light distribution. And the light source is designed...

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Abstract

The invention discloses an embedded packaging structure of an LED (light emitting diode) light source. The embedded packaging structure comprises a bracket, a base and an electrode, wherein the upper surface of the bracket is provided with a light source bowl cup. The embedded packaging structure is characterized in that an LED chip is connected with the electrode in series or in parallel and is arranged on the light source bowl cup, both the bottom of the bracket and the bottom of a base groove of the base matched with the bracket are flat-plate type, and the bracket is tightly adhered to the base. The embedded packaging structure has a simple and compact structure, is easy to manufacture and has the advantages of reasonable heat-dissipating structure and good heat-dissipating effect.

Description

technical field [0001] The invention relates to an embedded packaging structure of an LED light source. Background technique [0002] With the continuous innovation in the field of light-emitting diode (LED) technology, ultra-high-power LED products have been produced. However, the general products use large-area metal bases and use aluminum substrates as heat sinks to conduct heat generated by LED chips when they emit light. in the air. Encapsulation with a single large-size or multiple small-size chips can also effectively increase the power and brightness of the LED, but because the heat dissipation structure is not reasonable, it still cannot solve the problem of high heat when the chip is working, resulting in LED chips that are prone to light decay, Burned, and the process is difficult, the cost is high, and it is not easy to promote. [0003] An improved packaging structure has been developed, such as a high-power LED lamp bracket disclosed by the authorized announc...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V17/00F21V29/00F21Y101/02F21V29/74
Inventor 周大永王伟福程万潇
Owner NINGBO YINZHOU LEIMAI SEMICON TECH
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